Thermal/Mechanical Field Application Engineer jobs in United States
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Foxconn · 1 month ago

Thermal/Mechanical Field Application Engineer

Foxconn E BG Group is the world’s largest electronics manufacturer and leading provider of technological solutions. The Thermal/Mechanical Field Application Engineer will provide technical support for customer design and engineering teams, acting as a bridge between R&D and client-facing functions to ensure successful product design, deployment, and ongoing performance.

Consumer ElectronicsElectronicsHardwareInformation TechnologyManufacturingProduct DesignSoftware

Responsibilities

Provide application and product-level support to clients, including AWS, Microsoft, Meta, and other partners in the Greater Seattle area
Collaborate with customer engineering teams on integration, debugging, and performance optimization
Translate client technical requirements to internal R&D teams
Deliver product training, demos, and documentation to customers
Act as primary technical point of contact during pre-sales, evaluation, and post-deployment phases
Analyze and resolve field issues and recommend solutions
Create field reports, support documentation, and provide feedback for continuous improvement
Determine customer requirements (both explicit and implicit) and accurately communicate them back to key engineering team members
Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing)
Ability to manage multiple customer opportunities simultaneously and prioritizing actions appropriately
Must understand customer design cycles to drive our product design-in opportunities
Leverage extensive personal experience in thermal/mechanical/electrical design and material science to become a trusted partner for our customers
Will support all required rework in US & Mexico if required. Travel US Domestic, Mexico & Asia as needed
Traveling with our commercial team, the Field Application Engineer will be the primary customer interface for all technical discussions
Perform other duties as requested or assigned

Qualification

Thermal engineeringMechanical engineeringField applicationsLiquid cooling solutionsSystems integrationFluency in MandarinCommunicationInterpersonal skillsSelf-motivated

Required

Bachelor's degree in mechanical or thermal engineering, or related field
Minimum 3–5 years of relevant experience as thermal applications engineer, mechanical engineer or related in field applications, systems integration, or embedded systems
Excellent communication skills and interpersonal skills
Fluency in Mandarin required
Self-motivated personality

Preferred

Any liquid cooling solutions experience is preferred

Company

Established in Taiwan in 1974, Hon Hai Technology Group (Foxconn) (2317: Taiwan) is the world’s largest electronics manufacturer.

Funding

Current Stage
Public Company
Total Funding
$5.75B
Key Investors
Sprint Vc
2025-10-28Post Ipo Debt· $757.58M
2025-08-07Post Ipo Debt· $3.82B
2024-11-20Post Ipo Debt· $1.1B

Leadership Team

S
Shen Tao-pang
Chief Financial Officer
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IC Lin
Senior AVP
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Company data provided by crunchbase