Broadcom · 2 weeks ago
Package Design Engineer
San Jose, CA
Full-time
Onsite
Senior Level, Lead/Staff
$141K/yr - $226K/yr
10+ years expBroadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs. The role involves designing high-performance package structures for ASICs in areas such as artificial intelligence, networking, and 5G, while collaborating with a global R&D team.
MobileSemiconductorWireless
Responsibilities
Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts
Package Design of critical structures for SerDes, ADC/DAC, DDR, etc
Schedule, prioritize, & track your work across 2+ projects simultaneously
General flip-chip BGA package design & engineering
Project management and customer interface for your design projects
Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc
Physical design (layout) is a foundational responsibility in this role
Qualification
Required
BSEE or similar field and 12+ years' experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 10+ years' work experience
Knowledge of package-level signal integrity and power integrity, to apply to package designs
Self-management and organization skills
This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position
Preferred
Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK
Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
Benefits
Medical
Dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave
Vacation time
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
10001+ employees
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Leadership Team
Greg Singh
CTO for APJ, Enterprise Security Group
Kirsten Spears
CFO and CAO, Broadcom
Recent News
Company data provided by crunchbase