Product Engineering Internship, Simulation and Verification (Spring 2026) jobs in United States
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Cadence ยท 1 month ago

Product Engineering Internship, Simulation and Verification (Spring 2026)

Cadence is a technology company that hires and develops leaders and innovators. They are seeking a Product Engineering Intern for the Spring 2026 semester to work on simulation and verification-validation testing of high-speed digital systems.

AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

As a Product Engineering intern, you will get the opportunity to work on the simulation, and verification-validation testing of high-speed digital systems
Simulate PCBs and packages in commercial 2.5D electromagnetics simulators to extract models and subsequently, impedance profiles; perform time domain analysis
Provide feedback to developers on simulation tool usage

Qualification

ElectromagneticsSignal ProcessingSignal Integrity AnalysisMachine LearningSystem AnalysisOptimizationChannel TheoryCadence SIgrityADSHFSS

Required

Currently enrolled as student pursuing MSEE, or equivalent
Experience or course work in electromagnetics, optimization, signal processing and system analysis, and channel theory or associated courses
Experience using signal integrity analysis and extraction tools (Cadence SIgrity, ADS, HFSS)
Must be available to work onsite in Burlington office 40 hours a week. This role is not remote and all applicants should currently be attending school within reasonable distance to Cadence's Burlington office location

Preferred

Interest in machine learning is a plus

Company

Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.

H1B Sponsorship

Cadence has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)

Funding

Current Stage
Public Company
Total Funding
unknown
1998-02-20IPO

Leadership Team

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Paul Cunningham
Senior Vice President and General Manager
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Tom Beckley
Senior Vice President, Custom IC & PCB Group
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Company data provided by crunchbase