Garmin · 2 weeks ago
Semiconductor Process Integration Engineer
Goleta, CA
Full-time
Onsite
Entry Level
$107K/yr - $123K/yr
1+ years expGarmin is seeking a full-time Semiconductor Process Integration Engineer with specialized expertise in inertial sensors in their Goleta, CA location. In this role, you will lead projects in a clean room environment, focusing on process development, integration, and device fabrication, while collaborating closely with cross-functional teams.
Consumer ElectronicsConsumer GoodsElectrical DistributionElectronics
Responsibilities
Serves as a project lead in a clean room environment, responsible for process development, process integration and device fabrication
Responsible for defining specifications, establishing qualification and acceptance criteria, and managing project budgets and timelines
Strong track record of process development, process optimization, design of experiments methodology, statistical data analysis and problem solving
Ability to combine disparate process recipes into a full fabrication flow and understand the impact of process interdependence
Possesses experience and process development expertise in contact/stepper photolithography, wet and plasma dry etches, high aspect-ratio deep reactive ion etching (DRIE) of silicon, glass and other relevant materials, chemical vapor deposition, dielectric and metal depositions, wafer bonding and vacuum encapsulation of microscale structures, sacrificial and structural layer creation and wet/dry release
Ability to conduct metrology such as optical/infrared microscope inspections, interferometric measurements and scanning electron microscopy with elemental analysis is required
Collaborates closely with cross-functional teams including electrical engineers, mechanical engineers, and manufacturing teams
Offers process improvement suggestions, authors new procedures, and provides technical input to product development plans and concept documents along with making substantial contributions toward determination of project goal/objective feasibility
Demonstrated strong documentation skills in fabrication process development and experimental work
Ability to modify and/or review mask layouts in CAD layout software such as Klayout
Qualification
Required
Bachelor's Degree in Electrical Engineering, Computer Engineering, Software Engineering or related field AND a minimum of 1 year relevant experience OR an equivalent combination of education and experience
Excellent academics (cumulative GPA greater than or equal to 3.0 as a general rule)
Strong track record of process development, process optimization, design of experiments methodology, statistical data analysis and problem solving
Ability to combine disparate process recipes into a full fabrication flow and understand the impact of process interdependence
Possesses experience and process development expertise in contact/stepper photolithography, wet and plasma dry etches, high aspect-ratio deep reactive ion etching (DRIE) of silicon, glass and other relevant materials, chemical vapor deposition, dielectric and metal depositions, wafer bonding and vacuum encapsulation of microscale structures, sacrificial and structural layer creation and wet/dry release
Ability to conduct metrology such as optical/infrared microscope inspections, interferometric measurements and scanning electron microscopy with elemental analysis is required
Collaborates closely with cross-functional teams including electrical engineers, mechanical engineers, and manufacturing teams
Offers process improvement suggestions, authors new procedures, and provides technical input to product development plans and concept documents along with making substantial contributions toward determination of project goal/objective feasibility
Demonstrated strong documentation skills in fabrication process development and experimental work
Ability to modify and/or review mask layouts in CAD layout software such as Klayout
Demonstrated ability with application of design standards and procedures to design and develop moderately complex analog, digital and/or RF designs including simulations, schematics, PCB layouts and evaluation
Demonstrated ability with electrical engineering tools
Demonstrated knowledge of design impacts on manufacturability
Preferred
Back-end wafer process experience in wafer grinding, CMP, die singulation and assembly processes into packages is a plus
Experiences with project management, budgeting, and scheduling
Ability to conduct fabrication data analysis through scripting in MATLAB or Python is a plus
Experiences with automation on fabrication data collection is a plus
Knowledge of semiconductor reliability requirements and compliance with standards such as JEDEC is desirable
Benefits
Garmin's benefit program
Company
Garmin
WHERE DO WE START? How about Kansas City? That’s our home. That’s where Garmin put a stake in the ground in 1989.
10001+ employees
H1B Sponsorship
Garmin has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (69)
2024 (61)
2023 (40)
2022 (85)
2021 (85)
2020 (76)
Funding
Current Stage
Late StageTotal Funding
unknown2007-01-04Acquired
Leadership Team
Doug Boessen
Chief Financial Officer and Treasurer
Amber Morgan
Global Partnerships & Engineering Business Development
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2025-10-07
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