R&D Engineer IC Design 3 jobs in United States
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Broadcom · 5 hours ago

R&D Engineer IC Design 3

Broadcom is a leading technology company specializing in semiconductor and infrastructure software solutions. They are seeking an R&D Engineer IC Design 3 to work on chip design for high-speed optical fiber communication, involving tasks such as HDL coding, design documentation, and silicon debugging.

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H1B Sponsor Likelynote

Responsibilities

This opening work on chip design which enables 100Gbps/200Gbps/400Gbps optical fiber communication
Prepare detailed design document
HDL coding, equivalency checking, STA result review, CDC checks, Lint checks, RTL/gate level simulations & silicon debugging
Scripting for various IC design tasks such as STA, equivalency checks, silicon debug etc
Prepare block level resource requirements & development schedule
Generate test plans for post silicon validation

Qualification

HDL codingHigh speed digital designDigital signal processingVerilogPythonAnalytical skillsFEC knowledgeOptical fiber communicationProblem solving skillsCommunication skillsOrganization skills

Required

B.S degree in EE or computer Engineering and 5+ years of related experience
M.S degree/Ph.D in EE or Computer Engineering and 3+ years of related experience
Good knowledge of high speed digital circuit design
Good knowledge of digital signal processing, such as FFE/MLSE and fixed point implementation
Good knowledge of ARM subsystem
Strong analytical and problem solving skills as well as hands-on lab debugging experiences
Good Knowledge in languages relevant to the ASIC/system development process including Verilog, Unix/Perl Scripting or Python, matlab and C
Self-motivated, excellent communication skills and ability to excel in a team environment
Good organization skills, able to follow through & bring issue to closure
Be able to work with teams at remote locations with different time zone

Preferred

FEC knowledge is a plus
Knowledge Backplane/cable/optical fiber communication

Benefits

Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave
Vacation time

Company

Broadcom

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Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.

H1B Sponsorship

Broadcom has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)

Funding

Current Stage
Public Company
Total Funding
unknown
2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO

Leadership Team

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Greg Singh
CTO for APJ, Enterprise Security Group
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Kirsten Spears
CFO and CAO, Broadcom
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Company data provided by crunchbase