Plasma Enhanced CVD Semiconductor Process Engineer / Principal Plasma Enhanced CVD Semiconductor Process Engineer 2nd shift - R10215993 jobs in United States
cer-icon
Apply on Employer Site
company-logo

Northrop Grumman · 1 month ago

Plasma Enhanced CVD Semiconductor Process Engineer / Principal Plasma Enhanced CVD Semiconductor Process Engineer 2nd shift - R10215993

Northrop Grumman is a leading company in technological advancements, seeking a Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer. The role involves sustaining and developing PECVD processes for semiconductor products, while collaborating with various engineering teams on process improvement projects.

AerospaceData IntegrationManufacturingRemote SensingSecurity
check
Growth Opportunities
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

All aspects of sustaining existing PECVD processes for a development line including process qualifications and technician training
Interfacing with other unit process engineers, operations, and integration engineers during the design and execution of process/equipment improvement projects
Developing PECVD processes for new materials
Developing new PECVD processes for emerging technologies in both microelectronics and superconducting electronics
Writing and maintaining process documentation
Supporting statistical process control (SPC) and continuous improvement efforts
Performing all other related duties as assigned

Qualification

PECVD process engineeringTEOSSilane depositionThin film characterizationStatistical process controlCleanroom experienceData analysisProject managementProblem-solving methodology

Required

Bachelor of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or any related STEM degree with 2 years relevant industry experience (Masters with 0 yrs exp)
Hands-on experience running PECVD/Diffusion process equipment and with process sustaining/development activities
Experience with TEOS- and silane-based dielectric deposition
Experience with thin film characterization equipment and techniques
Experience with PECVD/Diffusion
Must be able to work a large percentage of time working in a Class 100 cleanroom environment
Must be able to work the 2nd shift, covering at a minimum Monday – Friday 2pm-11pm
Knowledge of statistical process control (SPC)
Must be able to obtain and maintain a Secret clearance
US Citizenship required
Bachelor of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or any related STEM degree with 5 years relevant industry experience (Masters with 3 yrs exp or PhD with 1 yr exp)
Hands-on experience running PECVD/Diffusion process equipment and with process sustaining/development activities
Experience with TEOS- and silane-based dielectric deposition
Experience with thin film characterization equipment and techniques
Experience with PECVD/Diffusion
Must be able to work a large percentage of time working in a Class 100 cleanroom environment
Must be able to work the 2nd shift, covering at a minimum Monday – Friday 2pm-11pm
Knowledge of statistical process control (SPC)
Must be able to obtain and maintain a Secret clearance
US Citizenship required

Preferred

Direct experience with semiconductor fabrication, working in a cleanroom environment
Demonstrated ability to communicate well with others and work independently
Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions
Experience in structured problem-solving methodology to troubleshoot tool and process issues
Data analysis and visualization (JMP and/or MiniTab)
Advanced knowledge of statistical process control (SPC)
Active Secret clearance

Benefits

Health insurance coverage
Life and disability insurance
Savings plan
Company paid holidays
Paid time off (PTO) for vacation and/or personal business

Company

Northrop Grumman

company-logo
Northrop Grumman is an aerospace, defense and security company that provides training and satellite ground network communications software.

Funding

Current Stage
Public Company
Total Funding
$3.7B
Key Investors
U.S. Department of DefenseNASA
2025-05-27Post Ipo Debt· $1B
2024-01-29Post Ipo Debt· $2.5B
2023-12-20Grant· $72M

Leadership Team

leader-logo
Tom Wilson
Corporate Vice President, Enterprise Business Development
linkedin
leader-logo
Jeffrey Worsham
Chief Product Owner - Advanced Technology Development
linkedin
Company data provided by crunchbase