Apple · 1 month ago
IC Packaging Integration Engineer
Santa Clara, California, United States
Full-time
Onsite
Senior Level, Lead/Staff
$181K/yr - $318K/yr
10+ years expApple is a company that believes new ideas can quickly become extraordinary products and services. They are seeking a versatile and passionate IC Packaging Engineer to work on groundbreaking technologies, leading SoC Package integration and architecture efforts, and driving advanced package solutions.
AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
Responsibilities
Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements
Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM)
Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase
Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution
Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement
Qualification
Required
BS and 10+ years of experience in relevant industry experience
Preferred
MS/PhD and 6+ years of experience in relevant industry
Experience in the semiconductor packaging and/or system integration
Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration
Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
Excellent problem solving with strong physics and fundamentals
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers
Basic knowledge of signal integrity/power integrity
Ability to review schematics, package/PCB layout and designs in Allegro
Benefits
Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
10001+ employees
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)
Funding
Current Stage
Public CompanyTotal Funding
$5.67BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
Venrock
2025-12-01
2025-09-25
Mac Daily News
2025-09-25
Company data provided by crunchbase