MGR II R&D/PRODUCT DVL ENGINEERING jobs in United States
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TE Connectivity · 1 month ago

MGR II R&D/PRODUCT DVL ENGINEERING

TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. In this role, you will lead a team of signal integrity engineers in the design and development of high-speed products while ensuring alignment with business objectives and fostering a culture of innovation and employee wellbeing.

AutomotiveElectrical DistributionHardwareManufacturingSoftware
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H1B Sponsor Likelynote

Responsibilities

Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products
Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface
Guide the team in connector design and qualifications from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement
Create actionable recommendations based upon design reviews and simulation results
Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community
Align the technology roadmap with the market trends, customer needs, and implement accordingly
Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions
Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures
Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability
Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives

Qualification

Electrical EngineeringSignal Integrity AnalysisLeadership ExperienceElectromagnetic Theory3D CAD ToolsHigh-Speed Test EquipmentInterconnect DesignCoachingInnovation CultureCommunication Skills

Required

Bachelor's degree in Electrical Engineering or equivalent work experience
Generally requires 10 years of relevant work experience in electrical Design, RF design or PCB design
Generally requires a minimum of 3 years of progressive leadership and people management experience in a regional environment
A solid understanding of electromagnetic theory and electrical circuit behavior
Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
Proficient with high-speed test equipment (VNA, TDR, BERT)
Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration

Preferred

Master's Degree

Benefits

A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.

Company

TE Connectivity

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TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.

H1B Sponsorship

TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)

Funding

Current Stage
Public Company
Total Funding
$3.1B
2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M

Leadership Team

T
Terrence R. Curtin
Chief Executive Officer
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Heath A. Mitts
Chief Financial Officer
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Company data provided by crunchbase