Cisco · 2 months ago
Packaging Technical Leader
San Jose, California, US
Full-time
Hybrid
Senior Level
$169K/yr - $241K/yr
6+ years expCisco is seeking a seasoned Packaging Technical Leader to join the Semi & Optics Packaging team within our world-class Supply Chain Organization. In this role, you will drive innovation in advanced packaging technology and quality for Cisco’s cutting-edge ASIC and silicon photonic products, while collaborating with various teams to influence next-generation technologies.
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Responsibilities
Serve as a technical leader in advanced packaging technology (2.5D/3D, TSV, MCM, flip-chip, heterogenous integration). Oversee various aspects such as package assembly, process development, reliability qualification, materials and testing
Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products
Multi-functional technical leadership to proactively identify and mitigate risks, and resolve highly complex packaging issues. Drive/support quality initiatives such as failure analysis (FA), root cause finding, and implementation of corrective actions
Work collaboratively with design teams to influence package architecture and provide expert guidance on Design for Manufacturability/Reliability (DfM, DfR) contributing to the definition of critical parameters for HVM
Contribute to evaluation of new packaging methods, materials and processes for Cisco product design and implementation
Qualification
Required
6+ years of progressive industry experience in Semiconductor Packaging or Photonic packaging or Assembly process development or integration, with demonstrable track record of technical leadership and successful project execution
Knowledge of advanced packaging processes (bumping, flip-chip, TSV, 2.5D/3D, MCM) and materials
Experience with package design & architecture. Familiar with advanced substrate manufacturing processes and materials and their impact on signal and power integrity
Experience in advanced problem-solving methodologies (e.g. 8D, FMEA, statistical process control) and data analysis skills
Knowledge and experience in physical failure analysis methods
Preferred
Familiarity or experience with co-packaged optics is a plus
Experience with volume manufacturing
Experience with advanced simulation tools for package design and reliability analysis
Ability to work within and lead projects with highly multi-functional and geographically distributed technical teams
Willingness to learn and evolve professionally
Benefits
Medical, dental and vision insurance
A 401(k) plan with a Cisco matching contribution
Paid parental leave
Short and long-term disability coverage
Basic life insurance
10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday
Paid year-end holiday shutdown
4 paid days off for personal wellness determined by Cisco
16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees
Cisco’s flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)
80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours of unused sick time carried forward from one calendar year to the next
Additional paid time away may be requested to deal with critical or emergency issues for family members
Optional 10 paid days per full calendar year to volunteer
Annual bonuses subject to Cisco’s policies
Performance-based incentive pay on top of their base salary
Company
Cisco
Cisco develops, manufactures, and sells networking hardware, telecommunications equipment, and other technology services and products. It is a sub-organization of Cisco Press.
10001+ employees
H1B Sponsorship
Cisco has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1238)
2024 (1231)
2023 (1273)
2022 (2127)
2021 (1991)
2020 (1173)
Funding
Current Stage
Public CompanyTotal Funding
unknown1990-02-13IPO
Leadership Team
Chuck Robbins
Chair and CEO
Carl Solder
Chief Technology Officer - Cisco System Australia/New Zealand
Recent News
2026-01-08
The Hollywood Reporter
2026-01-07
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