Infineon Technologies · 4 hours ago
Process Engineer
Infineon Technologies is a global leader in semiconductor solutions, focusing on power systems and IoT. They are seeking a Process Engineer to provide manufacturing support, drive operational efficiency, and implement continuous improvement initiatives in backend processes.
Consumer ElectronicsElectronicsEnergy EfficiencyManufacturingSemiconductor
Responsibilities
Maintain a high-profile presence in the manufacturing area to provide sustaining manufacturing support. Resolves day to day production issues. Drives issues to root cause
Apply manufacturing best practices to drive reliability and predictability into our processes
Develop, lead and implement projects which improve operational efficiency and deliver savings which support corporate objectives, such as; on–time delivery, productivity, scrap reduction, etc
Routinely works on complex issues where analysis of situations or data requires in–depth evaluation of factors. Resolve various assembly and mechanical screening process issues through the use of structured problem solving techniques like 8D and related tools
Lead teams and implement projects through continuous improvement initiatives, such as Lean or Six Sigma with hands–on application – be an engaging floor practitioner
Identify and address project risks related to backend processes and materials, through the translation of DFMEA to PFMEA, and using other methods of risk management
Take the initiative to look for and take advantage of opportunities and take independent actions and calculated risks
Help transition new products from R&D to Pilot and HVM following stage/gate process
Define the long-term process technology development roadmaps needed for new and next generation products
Aside from working with internal manufacturing site, investigate and work with assembly and screening OSATs that will contribute to new product developments. Support supplier quality, purchasing and other groups to identify and work with material vendors impacting assembly and mechanical screening processes
Qualification
Required
Bachelor of Science (or equivalent) degree in engineering, such as mechanical, chemical, materials, manufacturing, electrical, or electronics engineering
Minimum 5 years in backend semiconductor or electronic assembly process and/or package engineering; including hands-on experience package and process development for new products
Strong knowledge in developing on-site and outsourced backend processes, such as die attach, wire bond, package sealing, lead finish, trim and form, and mechanical assemblies
Effective team leader and member, ability to collaborate with other teams and IR-Hi-Rel/Infineon sites for best practice, resource and knowledge sharing, and lead as expert mentoring technicians and new engineers
Skilled in tools for new process development, process optimization, and continuous improvement such as DFM reviews, DOE, 8D, FMEA, Control Plans, OCAP, and statistical analysis methods/tools
Strong multi-tasking and prioritization skills. Effective in defining schedules and project completion
Self-starter, fast-learner with experience working in fast-pace and dynamic manufacturing environment
Emphasizes personal and professional growth. Keeps technical and business knowledge and skills current
Demonstrated strong verbal and written communication skills
Benefits
All employees will be eligible to participate in an incentive plan
Company
Infineon Technologies
Infineon Technologies offers semiconductor solutions, microcontrollers, LED drivers, sensors and Automotive & Power Management ICs.
Funding
Current Stage
Public CompanyTotal Funding
$5.55BKey Investors
European Commission
2025-02-20Grant· $966.23M
2025-02-07Post Ipo Debt· $779.85M
2025-02-04Post Ipo Debt· $2.07B
Leadership Team
Recent News
2026-01-12
2026-01-11
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