Texas Instruments · 1 month ago
Career Accelerator Program - Packaging Engineer - MS/PhD
FORE 12500 TI Boulevard, Dallas, TX, 75243, US
Full-time
Onsite
New Grad, Entry LevelTexas Instruments is offering a Career Accelerator Program for new college graduates to gain professional and technical training in semiconductor packaging engineering. The role involves collaborating across various teams to design and analyze packaging technologies that enhance TI's product offerings.
ComputerDSPSemiconductor
Responsibilities
Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages
Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs
Qualification
Required
Master's Degree in Engineering or related field
Participation in the Career Accelerator Program (CAP)
Ability to interface across various work areas and organizations
Experience in design, development, and analysis of semiconductor packaging technologies
Knowledge of Wirebond, Flip Chip, Modules, SIPs and other advanced packages
Experience in cross-functional teams supporting product qualification and production
Ability to meet reliability and yield requirements
Experience in design testability and test coverage
Ability to conduct design-of-experiments
Experience working with material suppliers to select innovative packaging materials
Ability to conduct electrical, mechanical, thermal models
Understanding of silicon-to-package interaction
Ability to establish design rules and predict high risk designs
Strong prioritization skills and adaptability
Ability to thrive in a fast-paced, dynamic environment
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
Founded in 1930
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2026-01-09
Company data provided by crunchbase