Electronics Packaging Power Delivery Technology Lead jobs in United States
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AMD · 2 weeks ago

Electronics Packaging Power Delivery Technology Lead

AMD is a leading company focused on building innovative products for next-generation computing experiences. The role involves driving power delivery technology and design tool development for advanced packaging technologies, particularly for AI products, while managing stakeholder relationships and enhancing EDA tools.

AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Drive AMD’s CAD and EDA tool vendors to automate and simplify advanced package (‘3DIC’) power integrity design and analysis flows including EM/IR
Execute these flows as required in support of next generation advanced packaging projects
Enable packaging physical design engineers to independently execute a subset of these flows in order to reduce design cycles and improve the quality of early design releases
Enable automation and AI assistance to improve efficiency and reduce resource requirements for future product designs
Partner with packaging technology teams to identify and develop next-generation power delivery solutions

Qualification

Packaging EDA toolsPower integrity analysisPython codingTCL codingAI tools usageProgram managementPresentation skills

Required

B.S. degree in electrical engineering, computer engineering, or a related discipline plus five years of industry experience
Direct experience with packaging EDA tools
Direct experience with coding and automation

Preferred

Experience with coding in Python and TCL, particularly for the automation of CAD and EDA tools
Experience using AI agents to accelerate code development and EDA tool usage
Hands-on experience with at least one industry standard packaging physical design CAD tool
Hands-on experience with at least one industry standard tool for power integrity analysis

Benefits

AMD benefits at a glance.

Company

Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.

H1B Sponsorship

AMD has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (836)
2024 (770)
2023 (551)
2022 (739)
2021 (519)
2020 (547)

Funding

Current Stage
Public Company
Total Funding
unknown
Key Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
2023-03-02Post Ipo Equity
2021-06-29Post Ipo Equity

Leadership Team

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Lisa Su
Chair & CEO
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Mark Papermaster
CTO and EVP
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Company data provided by crunchbase