Intel Corporation · 2 weeks ago
Senior Packaging Thermal Architect
Hillsboro, OR
Full-time
Onsite
Senior Level, Lead/Staff
$137K/yr - $263K/yr
10+ years expIntel Corporation is a leading technology company focused on semiconductor manufacturing and innovation. The Senior Thermal Architect will lead thermal design and strategy for next-generation GPU, AI accelerators, and data center products, ensuring optimal thermal performance and compliance across various levels of product design.
Semiconductors
Responsibilities
Define and deliver advanced packaging thermal solutions for advanced GPU/AI products
Architect thermal strategies for 3DIC and advanced packaging technologies, including chiplets and heterogeneous integration
Develop analytical and experimental methods for thermal characterization and prediction
Drive co-optimization of thermal, electrical, and mechanical design across silicon, package, and system levels
Push the boundaries of thermal management to support Moore's Law progression
Evaluate and integrate emerging cooling technologies (e.g., liquid cooling, immersion cooling) for data center sustainability
Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance
Engage with external customers and ecosystem partners to align thermal solutions with product requirements
Qualification
Required
MS or PhD in Mechanical Engineering, Thermal Sciences, or related field
10+ years in thermal design of semiconductor products
Proven track record in thermal architecture and advanced packaging
Proficient in thermal simulation tools (e.g., CFD, FEA) and experimental validation
Preferred
10 + years experience in high-performance computing or data center products
Proven track record in GPU/AI thermal architecture and advanced packaging
Experience with rack-scale cooling solutions and liquid cooling technologies
Familiarity with AI/GPU performance trends and their thermal implications
Strong understanding of power delivery, energy efficiency, and cooling technologies
Ability to influence architecture decisions and drive innovation across global teams
Benefits
Competitive pay
Stock
Bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
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Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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