Senior Physical Design Applications Engineer Returnship jobs in United States
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Cadence ยท 13 minutes ago

Senior Physical Design Applications Engineer Returnship

Cadence is a global electronic design automation company that focuses on creating technologies essential for modern life. They are offering a 16-week paid returnship program for individuals looking to re-enter the workforce as Physical Design Application Engineers after a caregiving break, providing hands-on training and experience with EDA tools.

AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote
Hiring Manager
Mark Apton
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Responsibilities

Work with best in class EDA tools
Collaborate with R&D and the Sales team
Learn processes that are in the forefront of technology
Experience how teams solve problems

Qualification

Physical DesignDigital SynthesisPlaceRouteSignoff AnalysisEDA tools

Required

Must be a Physical Designer
Must have been out of the workforce for caregiving for a period of at least two years
Must have a minimum of three years of Physical Design work experience
Experience in Digital Synthesis
Experience in Place and Route
Experience in Signoff Analysis

Benefits

Paid vacation and paid holidays
401(k) plan with employer match
Employee stock purchase plan
A variety of medical, dental and vision plan options
Incentive compensation: bonus, equity, and benefits

Company

Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.

H1B Sponsorship

Cadence has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)

Funding

Current Stage
Public Company
Total Funding
unknown
1998-02-20IPO

Leadership Team

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Paul Cunningham
Senior Vice President and General Manager
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Tom Beckley
Senior Vice President, Custom IC & PCB Group
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Company data provided by crunchbase