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Etched · 1 month ago

Platform Intern

Etched is building the world’s first AI inference system purpose-built for transformers, delivering over 10x higher performance and lower cost. The Platform Intern will collaborate on mechanical and electrical engineering projects focused on high-performance computing systems.

AI InfrastructureArtificial Intelligence (AI)ComputerHardwareSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Collaborate across all aspects of mechanical architecture, advanced cooling, and CAD infrastructure for next-generation high-power density ASIC systems
Work within the mechanical and thermal engineering organization, with a strong focus on liquid cooling technologies and rack-level thermal management
Work on both hands-on product design and the development of the design and validation infrastructure needed to ensure our servers are robust, manufacturable, and performant at scale

Qualification

Mechanical EngineeringElectrical EngineeringThermal EngineeringBoard DesignSystem Integration

Required

Progress towards a Bachelor's or Master's in Mechanical Engineering, Electrical Engineering, Computer Engineering, or related field
Experience in mechanical and thermal engineering for high-performance computing systems or experience in electrical engineering, system validation, or platform/server design
Knowledge of board design, high-speed interconnects, power delivery, and system integration

Benefits

Generous housing support for those relocating
Daily lunch and dinner in our office

Company

Etched

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Building the hardware for superintelligence

H1B Sponsorship

Etched has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (9)
2024 (11)
2023 (1)

Funding

Current Stage
Growth Stage
Total Funding
$125.36M
Key Investors
Primary Venture Partners
2024-06-25Series A· $120M
2023-05-16Seed· $5.36M

Leadership Team

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Chris Zhu
Co-Founder
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Robert Wachen
Co-Founder and President
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Recent News

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