Etched · 1 month ago
Platform Intern
Etched is building the world’s first AI inference system purpose-built for transformers, delivering over 10x higher performance and lower cost. The Platform Intern will collaborate on mechanical and electrical engineering projects focused on high-performance computing systems.
AI InfrastructureArtificial Intelligence (AI)ComputerHardwareSemiconductor
Responsibilities
Collaborate across all aspects of mechanical architecture, advanced cooling, and CAD infrastructure for next-generation high-power density ASIC systems
Work within the mechanical and thermal engineering organization, with a strong focus on liquid cooling technologies and rack-level thermal management
Work on both hands-on product design and the development of the design and validation infrastructure needed to ensure our servers are robust, manufacturable, and performant at scale
Qualification
Required
Progress towards a Bachelor's or Master's in Mechanical Engineering, Electrical Engineering, Computer Engineering, or related field
Experience in mechanical and thermal engineering for high-performance computing systems or experience in electrical engineering, system validation, or platform/server design
Knowledge of board design, high-speed interconnects, power delivery, and system integration
Benefits
Generous housing support for those relocating
Daily lunch and dinner in our office
Company
Etched
Building the hardware for superintelligence
H1B Sponsorship
Etched has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (9)
2024 (11)
2023 (1)
Funding
Current Stage
Growth StageTotal Funding
$125.36MKey Investors
Primary Venture Partners
2024-06-25Series A· $120M
2023-05-16Seed· $5.36M
Recent News
Soma Capital
2026-01-07
Google Patent
2025-04-02
Google Patent
2024-12-04
Company data provided by crunchbase