Qualcomm · 2 weeks ago
Staff Packaging Engineer
San Diego, CA
Full-time
Onsite
Senior Level, Lead/Staff
$154K/yr - $231K/yr
8+ years expQualcomm Technologies, Inc. is seeking a highly motivated Staff Packaging Engineer to lead advanced integrated circuit packaging development. This role involves driving innovation in packaging for various markets and managing the introduction of new product technologies into high-volume manufacturing.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Explore, develop, and deploy FCCSP, FCBGA, and/or SiP/Module packaging technologies for high-volume manufacturing
Initiate and define package process flows, material sets and Best Known Methods (BKM), test vehicles, Design of Experiments (DOEs) and cornering, and process control plans to ensure the successful development of manufacturable and reliable products
Interface with OSATs, substrate and material suppliers, and tool makers to develop technology in alignment with product requirements. Coordinate with internal product teams on establishing Design Rules
Collaborate with the internal design team and promote Design for Manufacturability (DFM) methodology for new technologies
Work with internal design, modeling, and procurement teams to implement packaging solutions that are technically optimal and cost-effective
Manage technical programs, including planning, execution, and monitoring of complex processes or product developments. Provide regular updates on program status to management and share progress with cross-functional team members
Demonstrate strong knowledge and understanding of Failure Mode and Effects Analysis (FMEA), Statistical Process Control/Quality Control (SPC/QC) concepts, failure mechanisms, failure analysis techniques, manufacturing floor operations, and quality issue resolution
Qualification
Required
At least 8+ years of experience in the development and high-volume manufacturing of advanced IC packages
Expertise in Flip Chip CSP, FCBGA, and SiP packaging materials, assembly processes, equipment, and design rules
Strong understanding of Laser Groove technology and Wire Bond process optimization
Excellent verbal and written communication skills
Demonstrated ability in organized technical project management
Capable of working independently and leading multiple programs
Able to lead multi-functional teams to address complex technical challenges
Self-driven, passionate, and creative
Bachelor's degree in electrical engineering, Mechanical Engineering, Materials Science, Chemical Engineering, a related field, or equivalent practical experience
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience
Preferred
Hands-on experience in package manufacturing, technical project management, and direct collaboration with semiconductor material suppliers
Understand industry packaging trends, end-user packaging needs, and prior experience with high-end mobile consumer products
Proficiency in material and package characterization and statistical data analysis
Familiarity with reliability test methods and qualification procedures
Six Sigma Green or Black Belt certification is a plus
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President & CEO
I
Isaac Eteminan
CEO
Recent News
2026-01-16
2026-01-16
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