Co-Founder / Chief Technology Officer (Advanced Packaging & Test / OSAT+) - Equity only in the beginning -> Salary after funding jobs in United States
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NextZen AI · 1 month ago

Co-Founder / Chief Technology Officer (Advanced Packaging & Test / OSAT+) - Equity only in the beginning -> Salary after funding

NextZen AI is building a new advanced packaging and test platform focused on the bottleneck of the artificial intelligence hardware world. They are seeking a Co-Founder / Chief Technology Officer with deep experience in advanced packaging to architect the platform from day zero.

Information Services

Responsibilities

Designing and qualifying attach, underfill, reflow, clean, inspection, and reliability flows for Graphics Processing Unit / High Bandwidth Memory, flip-chip ball grid array, and two-and-a-half-dimensional / three-dimensional assemblies
New Product Introduction through to ramp: designing Design of Experiments, running first-article and qualification lots, driving Statistical Process Control, and owning yield and Overall Equipment Effectiveness targets
Tool and facility decisions for the Folsom / Sacramento Failure Analysis lab and the first Arizona attach and test line (Mechanical, Electrical, and Plumbing loads, layouts, and vendor selection)
Technical customer interface with artificial intelligence chip companies, hyperscalers, memory vendors, and original equipment manufacturers
Building and mentoring the first engineering team (New Product Introduction, reliability, Failure Analysis technicians, quality)

Qualification

Advanced semiconductor packagingFailure AnalysisNew Product IntroductionStatistical Process ControlYield managementC-Mode Scanning Acoustic MicroscopyAutomated X-ray InspectionTeam buildingTechnical customer interface

Required

10–20+ years in advanced semiconductor packaging, module engineering, or Failure Analysis at an Outsourced Semiconductor Assembly and Test provider or device maker
Experience in taking High Bandwidth Memory, interposer, chiplet, or flip-chip packages from New Product Introduction into volume production
Comfortable specifying and qualifying C-Mode Scanning Acoustic Microscopy, Automated X-ray Inspection, underfill and attach tools
Ability to read yield and defect paretos
Desire to be a true co-founder, not just an employee

Benefits

Bonus and benefits

Company

NextZen AI

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Funding

Current Stage
Early Stage
Company data provided by crunchbase