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SkyWater Technology · 3 months ago

Electroplating Engineer

200 NeoCity Wy, Kissimmee, FL 34744, USA

Full-time

Onsite

Mid, Senior Level

$110K/yr - $165K/yr

5+ years exp

SkyWater Technology is a leading semiconductor manufacturer dedicated to improving lives through innovative technology. The Electroplating Process Development Engineer will be responsible for developing and improving electroplating processes for advanced packaging technologies, ensuring high-quality production and effective communication with customers and team members.

AerospaceManufacturingService Industry

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Own overall responsibility for plating process development area, drive improvements in process, documentation, training with new process development/transfer in a manufacturing environment

Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans

Lead or work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications

Utilize metrology tools to characterize and document process results for transfer to production including CVS measurements, bath analysis and additions, thickness and fill characteristics

Investigate and drive integration changes for improved device performance and yield improvement

Work with process integration and tool engineers to find processing marginalities and make improvements

Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by process changes

Directly interface with management as a team leader or area owner for your unit process modules

Could develop into a Project Management position integrating Customer device requests

The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position

Qualification

ElectroplatingProcess DevelopmentBack-end-of-line processingDOESPCMEMS knowledgeProject ManagementCustomer interfacingProblem-solvingTeam Leadership

Required

BS Engineering (8 years)

Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience

5-8 years of engineering experience

Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans

MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree

Proficient in DOE and SPC

Knowledge of 6-sigma concepts and applications

Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes

Can work both independently and in (or lead) cross-functional teams for problem solving

US Citizenship Required

This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship