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Samsung Semiconductor · 1 month ago

CVD Process Engineer - Wafer Bonding

Austin, TX

Full-time

Onsite

Mid, Senior Level

$70K/yr - $179K/yr

5+ years exp

Samsung Austin Semiconductor is a world leader in advanced semiconductor technology, seeking an experienced CVD Process Engineer specializing in wafer bonding and de-bonding. The role involves delivering technical leadership, designing and executing process experiments, troubleshooting issues, and collaborating with cross-functional teams to enhance bonding techniques.

Semiconductor

H1B Sponsor Likely

Responsibilities

Prepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirements

Ensure tool to tool matching across fabs and between tools

Develop and maintain Preventative Maintenance schedules and procedures

Ensure bonding meets device and process output specifications

Successfully transfer and qualify process from development fab to HVM facility

Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans

Provide clear updates and instructions to users and management regarding ongoing issues and resolutions

Maintain FMEA and manage RPN reduction activity

Lead development and design experiments to carry out improvements in bonding yield, reliability, cost, and throughput

Collaborate with vendors in evaluation and qualification on new bonding and de-bonding techniques

Providing technical support and training to operators and technicians on equipment operation and procedures

Present key technical developments to SAS technical staff and management

Qualification

Wafer bonding techniquesFab Equipment managementData analysisSemiconductor environment experienceProgramming VBAProgramming PythonProgramming RProgramming SQLProject managementTeam-oriented cultureTechnical supportTrainingClean room environment

Required

Knowledge and familiarity with hybrid bonding techniques and equipment

Bachelor's degree in Engineering or a related technical discipline

Minimum of 5 years of engineering experience in Fab Equipment management

Minimum of 3 years in experience in wafer bonding and de-bonding equipment

Experience in the semiconductor environment or in high volume advanced manufacturing

Desire to take on technical challenges and shifting priorities in a fast paced cutting edge environment

Able to work with others in a team-oriented culture

Experience with data analysis: able to quickly analyze, summarize, and present data in an easy to understand format

Experience with project management and project prioritization. Ability to define milestones for a project, work in parallel on multiple projects, and balance long term projects with daily sustaining

Ability to rapidly come up to speed with new computer applications and systems

Able to work for several hours per day in a clean room environment

Preferred

Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc

Ability to manipulate and interpret equipment sensor data for the purpose of advanced equipment troubleshooting and setting up of controls for equipment sensors

VBA, Python, R, SQL, or other basic programming

Benefits

Medical, dental, and vision insurance

Life insurance and 401(k) matching with immediate vesting

Onsite café(s) and workout facilities

Paid maternity and paternity leave

Paid time off (PTO) + 2 personal holidays and 10 regular holidays

Wellness incentives and MORE

Company

Samsung Semiconductor

Samsung Semiconductor, Inc. (SSI) is a multi-billion dollar wide range of industry-leading semiconductor solutions.

Founded in 1974

San Jose, California, USA

10001+ employees

https://www.samsung.com/us/samsungsemiconductor

H1B Sponsorship

Samsung Semiconductor has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

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Trends of Total Sponsorships

2025 (130)

2024 (110)

2023 (153)

2022 (134)

2021 (124)

2020 (134)