Process Development Engineer, SiPho/Packaging/3D-HI jobs in United States
cer-icon
Apply on Employer Site
company-logo

Tower Semiconductor · 1 month ago

Process Development Engineer, SiPho/Packaging/3D-HI

Tower Semiconductor is focused on advancing semiconductor technology, and they are seeking a Process Development Engineer to lead the development of silicon photonics modules and capabilities. The role involves process development, prototype creation, and interaction with various stakeholders while ensuring successful technology delivery and customer enablement.

AerospaceAutomotiveManufacturingSemiconductor
check
H1B Sponsor Likelynote

Responsibilities

Help drive technology prototypes and process release to production
Interact with vendors, fabs, designers and customers
Hands-on test structure creation, layout, design for tape-out
Hands-on knowledge of tools, fab processing and technology qualification, including test structure methodology, reliability and yield improvement
Personal experience in semiconductor fabrication module development, process development, packaging, and process qualification
Modules will be developed for advanced packaging, 3D-HI, and for electro-optical circuits
May include customer and vendor-partner interactions as well as simulation and modeling
Some travel expected
Focus is foundry -- through technology delivery and fab and customer enablement
Execute the creation of .gds for masks, including test structure requirements for R&D and product qualification
Work in a fast paced, multidisciplinary environment focused on technology delivery
Enjoy working with diverse people and solving problems as part of a team or individually

Qualification

.gds layoutSemiconductor processingProcess developmentElectrical testProject managementTeam collaborationProblem solving

Required

Responsible for process development of specific modules and new capabilities for silicon photonics: development, prototypes and initial production
Help drive technology prototypes and process release to production
Interact with vendors, fabs, designers and customers
Hands-on test structure creation, layout, design for tape-out
Hands-on knowledge of tools, fab processing and technology qualification, including test structure methodology, reliability and yield improvement
Personal experience in semiconductor fabrication module development, process development, packaging, and process qualification
Modules will be developed for advanced packaging, 3D-HI, and for electro-optical circuits
May include customer and vendor-partner interactions as well as simulation and modeling
Some travel expected
Focus is foundry -- through technology delivery and fab and customer enablement
Get excited about creating new devices and process modules
Understand & enjoy key physical principles of materials and electrical / electro-optical components
Execute the creation of .gds for masks, including test structure requirements for R&D and product qualification
Work in a fast paced, multidisciplinary environment focused on technology delivery
Have experience in volume Semiconductor fab manufacturing
Enjoy working with diverse people and solving problems as part of a team or individually
Specific skills: .gds layout (e.g. Cadence Virtuoso software, others)
Demonstrated knack for project management and people skills
Strong understanding of semiconductor processing and integration
Minimum 5-10 years of experience in related semiconductor roles
MS or PhD degree in Materials, Electrical Engineering or other relevant field related to process module development, 3D-HI & packaging, Si Photonics, and Semiconductor development & manufacturing
Have personally fabricated device structures from design through fab and electrical test at any point in career
Electrical, optical or passive devices

Company

Tower Semiconductor

twittertwitter
company-logo
Tower Semiconductor manufactures analog integrated circuits for various industries like automotive, medical, industrial and aerospace.

H1B Sponsorship

Tower Semiconductor has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2022 (1)
2021 (1)

Funding

Current Stage
Late Stage
Total Funding
$115.42M
2016-06-01Series Unknown· $115.42M

Leadership Team

leader-logo
Crystal Krueger
Human Resources Business Partner
linkedin
leader-logo
Victer Chan
Direcotr of BiCMOS Integration Engineeing
linkedin
Company data provided by crunchbase