Micron Technology · 2 hours ago
Principal Thermal Simulation Engineer, APTD
Boise, ID
Full-time
Onsite
Lead/Staff
15+ years expMicron Technology is a world leader in innovating memory and storage solutions. The Principal Thermal Simulation Engineer will develop advanced memory packaging technologies and collaborate with various teams to optimize thermal designs and mitigate potential issues.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip-On-Wafer (COW), Flip Chip, Through Silicon Vias (TSV), etc
Work daily with multi-functional global teams, namely product design, product engineering, Technology Development, Business Unit, manufacturing, and external customers to fully understand the product thermal risks and help optimize the packaging design by simulation support
Work with internal/external vendors and testing labs to design and implement effective Thermal testing procedures to characterize materials for simulation analysis
Use advanced EDA techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal simulation applications such as ANSYS, Icepak, Flotherm, and evaluate new AI-assisted EDA tools as needed
Work with customers and propose new power maps and cooling solutions on SIP level that provide optimal memory performance
Qualification
Required
M.S. or Ph.D. in Mechanical Engineering or Materials Science with focus on Thermal Engineering
15 years working experience in relevant engineering areas with at least 10 years of experience on Thermal finite element analysis, modeling, and validation of electronic packages in the semiconductor industry
Detailed understanding of package thermal budget and thermal compression bonding process as well as Hybrid and other innovative bonding processing methods
Experience with engineering tools such as ANSYS Workbench, APDL, Abaqus, ProE, AutoCAD, Solid Works, and MATLAB
Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results
Preferred
Simulation, modeling, and analysis of thermal problems by multi-physics with Icepak, Flotherm
Ability to leverage global team members and develop new thermal characterization methods for new designs
Knowledge in product reliability tests like thermal cycling and other environmental stresses. Ability to understand if there is any power cycling vs Temp cycle Rel data correlation
Data acquisition experience, visualization techniques, and numerical analysis proficiency in MATLAB, Excel, JMP, etc
Benefits
Medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
2025-12-30
The Motley Fool
2025-12-29
Company data provided by crunchbase