Micron Technology · 1 week ago
Principal Design Engineer, TSV Packaging
Boise, ID
Full-time
Onsite
Lead/Staff
8+ years expMicron Technology is a world leader in innovating memory and storage solutions. They are seeking an experienced Principal Design Engineer to join their TSV Packaging team, focusing on the engineering analysis and design of high-performance memory devices to meet future mechanical requirements.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Stay up-to-date on semiconductor and advanced electronics packaging technologies like High Bandwidth Memory (HBM) and Flip Chip
Detailed understanding of thermal compression bonding process for chip-on-wafer and wafer-to-wafer hybrid bonding process and the corresponding Multiphysics mechanisms involved to capture in the simulation
Collaborate daily with global teams in product design, engineering, technology, and business units to analyze manufacturing processes using simulation
Understanding of packaging materials and their production processes. Work with internal/external vendors and testing labs to craft and implement effective testing procedures to characterize materials for simulation analysis
Maintain an understanding of measurement methodologies and coordinate measurement data collection of packages and packaging materials for correlation of simulation activities
Develop semiconductor packages with advanced EDA techniques and simulation tools like ANSYS, Icepak, Flotherm
Qualification
Required
8+ years working experience in Mechanical and Thermo-mechanical finite element analysis, modeling and validation of electronic packages in Semiconductor industry or equivalent
Engineering tools: ANSYS Workbench, APDL, Abaqus, ProE or equivalent experience, AutoCAD, Solid Works, MATLAB
M.S. / Ph.D. in Mechanical Engineering, Material science, or related Engineering field
Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results
Seeking a dedicated, motivated individual to balance tasks efficiently and work well in a team
Preferred
Simulation, modeling, and analysis of thermos-mechanical problems by multi-physics with software like Ansys, COMSOL, etc
Proven academic training and research experience in Solid and fluid mechanics
Experience in performing fracture simulations for IC packages
Experience in semiconductor process simulation like wafer-to-wafer bonding process, thermal compression bonding process, mass reflow process, die ejection process, etc
Ability to bring to bear the distributed team members and develop new characterization methods for new designs
Knowledge in product reliability tests like thermal cycling, and other environmental stresses
Mechanical design capability (2D, 3D) with SolidWorks, AutoCAD, etc
Data acquisition experience and numerical analysis proficiency in MATLAB, Excel, JMP, etc
Benefits
Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
2026-01-09
The Motley Fool
2026-01-09
2026-01-09
Company data provided by crunchbase