Rigetti Computing · 1 month ago
Process Technician, Packaging & Assembly
Fremont, CA
Full-time
Onsite
Mid Level
$42/hr - $50/hr
3+ years expRigetti Computing is developing cloud-deployed quantum computers to solve humanity’s most pressing and valuable problems. As a Process Technician in Packaging & Assembly, you will be responsible for sustaining activities in the backend packaging process toward building quantum integrated circuits, working closely with engineers and scientists in a fast-paced environment.
AI InfrastructureArtificial Intelligence (AI)Big DataHardwareQuantum ComputingSemiconductorSoftware
Responsibilities
Run day-to-day assembly & packaging activities, including: die-pick from wafer, visual inspection, plasma cleaning, flip-chip bonding, adhesive die-attach (manual), wire bonding (manual, semi-automatic, and automatic), wire-pull test, and relevant processes in a class 100 manufacturing cleanroom
Activities will include equipment setup and recipes creation, operation, incoming and outgoing part inspection, part rework, and providing timely feedback to engineers for process and yield improvements
Follow standard operating procedure, packaging diagrams, and written work instructions
Utilize die map, die inspection report, and electrical-test results for die-pick from wafer. Will require consistent use of tweezers, ESD precautions, and microscope to support manufacturing operations and damage-free die handling
Identify any sample issues and highlight them
Perform detailed documentation after assembly & packaging operations
Responsible for equipment and process calibration and monitors (SPC)
Work seamlessly with morning shift’s assembly & packaging technicians with clear, consistent communication and structured shift handoff procedure
Work seamlessly with other fab team members in the afternoon shift, and be responsible as backup technician for other fab modules
Qualification
Required
Associate or Bachelor's degree in STEM related fields or 3+ years of relevant, hands-on semiconductor / MEMS fab experience
Hands-on experience using and operating a wide range of semiconductor/MEMS assembly and packaging tools, such as wire bonders, die-attach, epoxy dispense, flip-chip assembly, and relevant metrology tools
Ability to operate and multi-task between multiple machines
Ability to use optical microscope 50% of your time – must have good hand-eye coordination and a steady hand
Comfortable working in a cleanroom environment, including hazmat handling protocols, and observing ESD practices
Comfortable operating in an agile, fast-paced small-company environment, with the flexibility to adjust work hours and workdays as needed
Detail-oriented, comfortable with computer-based recipe and wafer tracking systems
Strong planning abilities with excellent written and verbal communication skills
Comfortable with MS Office products, including Word, Excel, and PowerPoint, Google-docs
Preferred
Hands-on experience in die-prep tools, such as wafer mount, and wafer die eject is a definite plus
Experience in a small and/or large fab process environment
Benefits
Medical
Dental and vision for employees
401(k) plan
A paid parental leave program
Rejuvenation days
A vacation policy that aligns with local regulations and industry standards
Company
Rigetti Computing
Rigetti Computing is a quantum computing company that builds and deploys full-stack quantum systems with superconducting qubits.
51-200 employees
H1B Sponsorship
Rigetti Computing has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2023 (1)
2022 (1)
2020 (2)
Funding
Current Stage
Public CompanyTotal Funding
$783.45MKey Investors
Quanta ComputerSmall Business Research InitiativeBessemer Venture Partners
2025-06-11Post Ipo Equity· $350M
2025-04-30Post Ipo Equity· $35M
2024-11-25Post Ipo Equity· $100M
Leadership Team
Subodh Kulkarni
President and CEO
Brian Sereda
Chief Financial Officer
Recent News
2026-01-11
2026-01-11
Company data provided by crunchbase