Teledyne Micropac ยท 3 weeks ago
Senior Principal Development Engineer
Teledyne Micropac is seeking a technically versatile and experienced Senior Principal Development Engineer to lead the development of advanced electronic systems for defense and space applications. The role involves driving complex product designs, collaborating across multidisciplinary teams, and ensuring compliance with quality standards throughout the product development process.
Responsibilities
Lead product development from concept through prototype, validation, and production release
Individual contributor capable of leading a Engineer Design Team
Employ systems engineering disciplines, guiding requirements definition, architecture, and technical analysis
Ensure compliance with internal product development processes and quality standards
Support both sustaining engineering for standard products and new development programs for custom solutions
Design and support a range of electronic systems, including:
Optoelectronics: Emitters, receivers, optocouplers, fiber optics
Sensors & Displays: Hall effect assemblies, 7-segment displays, spacecraft lighting
Power Management: Solid-state relays (SSRs), solid-state power controllers (SSPCs), power distribution systems, including GaN-based technologies
Develop and define box-level hardware architectures, including interface definitions, environmental test and software requirements
Perform and review technical analyses such as electrical part stress, worst-case circuit analysis (WCCA), and derating
Generate and maintain detailed documentation including schematics, SDRLs, analysis reports, and part drawings
Lead and present at design reviews (PDR, CDR) for internal and external stakeholders
Proficiency in CAD tools such as OrCAD for schematic capture and PSpice for circuit analysis
Review or create mechanical CAD models using SolidWorks
Participate in regular onsite meetings and design reviews to ensure alignment with project timelines
Qualification
Required
B.S. in Electrical Engineering required
10+ years in electronic design engineering, preferably in defense or aerospace sectors
Proven ability to lead technical teams and mentor junior engineers
Multidisciplinary background across systems, mechanical, optical, thermal, and materials engineering
Strong understanding of product assurance, cost control, and schedule adherence
Passion for continuous learning and applying emerging technologies in defense and space applications
Lead product development from concept through prototype, validation, and production release
Individual contributor capable of leading a Engineer Design Team
Employ systems engineering disciplines, guiding requirements definition, architecture, and technical analysis
Ensure compliance with internal product development processes and quality standards
Support both sustaining engineering for standard products and new development programs for custom solutions
Design and support a range of electronic systems, including optoelectronics, sensors & displays, and power management
Develop and define box-level hardware architectures, including interface definitions, environmental test and software requirements
Perform and review technical analyses such as electrical part stress, worst-case circuit analysis (WCCA), and derating
Generate and maintain detailed documentation including schematics, SDRLs, analysis reports, and part drawings
Lead and present at design reviews (PDR, CDR) for internal and external stakeholders
Proficiency in CAD tools such as OrCAD for schematic capture and PSpice for circuit analysis
Review or create mechanical CAD models using SolidWorks
Participate in regular onsite meetings and design reviews to ensure alignment with project timelines
Preferred
MSEE preferred
Familiarity with military standards such as MIL-PRF-19500 and MIL-PRF-38534 is a plus
Benefits
Health, dental, and vision coverage
Retirement savings plan with company match
Paid time off and holidays
Opportunities for professional growth and innovation
Company
Teledyne Micropac
Teledyne Micropac provides optoelectronic components, electronic assemblies and multi-chip microelectronic modules.
Funding
Current Stage
Growth StageTotal Funding
unknown2024-11-06Acquired
Recent News
2024-01-30
Company data provided by crunchbase