Microchip Technology Inc. · 4 days ago
Engineer I-PCB Layout
Microchip Technology Inc. is a leading global organization focused on technology that powers the world. They are seeking a highly motivated Entry-Level Engineer I-PCB Layout Designer to join their Hardware Engineering team, focusing on the physical design of Printed Circuit Boards for power supply and power electronics circuits.
Responsibilities
Design and Implementation: Translate detailed electrical schematics, primarily for Switch-Mode Power Supplies (SMPS) and DC-DC converters, into optimized PCB layouts using industry-standard EDA tools
Component Placement Optimization: Execute strategic component placement to minimize parasitic effects (e.g., stray inductance and capacitance), optimize thermal performance, and meet mechanical constraints
Critical Signal Routing: Implement multi-layer routing strategies for high-current and sensitive control signals, ensuring minimal noise, crosstalk, and maintaining controlled impedance where required
Power and Ground Plane Design: Define robust and effective power/ground plane structures to ensure Power Delivery Network (PDN) integrity, minimize ground bounce, and manage electromagnetic compatibility (EMC)
Design for Manufacturability (DFM) & Assembly (DFA): Perform rigorous Design Rule Checks (DRC) and collaborate with PCB fabricators and assembly houses to ensure designs are cost-effective and manufacturable at volume
Technical Documentation: Generate comprehensive fabrication and assembly data packages, including Gerbers, drill files, assembly drawings, and Bills of Material (BOMs), ensuring accurate and complete transfer to manufacturing
Cross-Functional Collaboration: Actively work with Electrical, Mechanical, and Signal/Power Integrity Engineers to resolve technical challenges and incorporate design feedback throughout the layout process
Standard Compliance: Ensure all PCB designs strictly comply with relevant industry specifications, including IPC-2221 (Generic Design Standard), IPC-2222 (Rigid PCB Sectional Design Standard), and IPC-6012 (Qualification and Performance Specification for Rigid PCBs), particularly regarding conductor spacing and creepage for power sections
Qualification
Required
Bachelor of Science in Electrical Engineering (BSEE) from an accredited institution
0-3 years of Internship/Coursework Experience: Prior relevant experience through internships, co-op programs, or dedicated academic projects focused on PCB design, power electronics, or high-speed/high-current layout is a significant advantage
Solid theoretical and practical understanding of power supply topologies (e.g., Buck, Boost, Flyback) and the critical impact of layout on performance, efficiency, and noise
Foundational knowledge of key IPC standards: IPC-2221, IPC-2222, and IPC-6012
Proven ability to analyze design constraints (electrical, thermal, mechanical) and perform hand calculations for fundamental parameters like trace current capacity, impedance, and plane resistance
Excellent written and verbal communication skills to articulate design decisions, document progress, and clearly convey technical requirements to cross-functional teams and external partners
Basic understanding of Signal Integrity (SI) and Power Integrity (PI) principles as they relate to a PCB layout, particularly in minimizing loop areas for high-frequency current paths in power supplies
Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3)
Preferred
Demonstrated familiarity or direct experience with professional Electronic Design Automation (EDA) tools, specifically Altium Designer (highly preferred), Cadence Allegro, or Mentor Graphics PADS, for schematic capture and PCB layout
Familiarity with high-current trace width calculation (e.g., using IPC-2152 guidelines) is highly desired
Benefits
Health benefits that begin day one
Retirement savings plans
Industry leading ESPP program with a 2 year look back feature
Company
Microchip Technology Inc.
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions.
Funding
Current Stage
Public CompanyTotal Funding
$2.42BKey Investors
Opportunity Now ColoradoSevenBridge Financial GroupSequoia Capital
2025-03-21Post Ipo Equity· $1.32B
2024-05-29Post Ipo Debt· $1.1B
2024-03-19Grant· $1.06M
Recent News
2026-01-06
2026-01-06
2026-01-06
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