SkyWater Technology · 1 month ago
Copper Plating Senior Engineer
Austin, TX
Full-time
Onsite
Senior Level
5+ years expSkyWater Technology is a company that manufactures U.S. made semiconductors essential for modern life. They are seeking an experienced semiconductor process engineer to maintain and improve the copper electroplating process, ensuring production metrics are met and driving process improvements.
AerospaceManufacturingService Industry
Responsibilities
Responsible for Copper electroplating process including bath chemistry dosing control systems
Maintain and improve process control through the use of Statistical Process Control (SPC), Advanced Process Control (APC), and Fault Detection Control (FDC)
Investigate and resolve process, defect, and yield issues, including qualifying process improvements which will require the use of Design of Experiments (DOE)
Work with the equipment and industrial engineers to improve tool availability, throughput, and utilization
Develop and execute plans to drive down overall costs while ensuring high quality
Work on cross functional teams to address integrated technology and yield issues
Qualification
Required
Bachelors Degree in Engineering, Chemistry or related discipline
5+ years of semiconductor manufacturing experience
Experience with Copper Electroplating at a semiconductor company
The ability to handle challenging work with time constraints
Good data analysis skills and the ability to use tools such as JMP and SQL
Benefits
401k match
Life insurance
Opportunities to purchase SkyWater stock at a discounted rate
Medical
Dental
Mental health benefits
Vision
Legal planning
Short- and long-term disability
Paid time off
Paid holidays
An on-site cafeteria
Fitness facility
Self-serve market
Company
SkyWater Technology
SkyWater Technology is a Semi-Conductor Manufacturer.
501-1000 employees
H1B Sponsorship
SkyWater Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2024 (1)
2021 (1)
2020 (3)
Funding
Current Stage
Public CompanyTotal Funding
$345MKey Investors
U.S. Department of Defense
2024-11-25Post Ipo Debt· $30M
2023-01-04Post Ipo Debt· $130M
2022-07-28Grant· $15M
Leadership Team
John Sakamoto
President and COO
Bassel Haddad
SVP and GM, Advanced Packaging
Recent News
2026-01-07
2026-01-05
Company data provided by crunchbase