Silicon Photonics Packaging Engineer Co-op jobs in United States
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Nokia · 3 weeks ago

Silicon Photonics Packaging Engineer Co-op

Nokia is a leading telecommunications company, and they are seeking a Silicon Photonics Packaging Engineer Co-op. The role involves working as an individual contributor in the Corporate Services sector, focusing on packaging engineering within the field of silicon photonics.

ElectronicsEnterprise SoftwareInternet of ThingsMobile DevicesTelecommunications
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Culture & Values
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H1B Sponsor Likelynote

Qualification

Electrical EngineeringPhysicsApplied PhysicsMaster’s DegreeIndividual Contributor

Required

Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA

Company

Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb.

H1B Sponsorship

Nokia has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (262)
2024 (264)
2023 (259)
2022 (250)
2021 (296)
2020 (287)

Funding

Current Stage
Public Company
Total Funding
$4.45B
Key Investors
European Investment BankNVIDIANational Telecommunications and Information Administration
2025-12-16Post Ipo Debt· $511.84M
2025-10-28Post Ipo Equity· $1B
2025-06-30Post Ipo Debt· $1.76B

Leadership Team

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Justin Hotard
President and CEO
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Victoria Hanrahan
Chief of Staff to the CEO
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Company data provided by crunchbase