Hardware Engineer, Principal jobs in United States
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MACOM · 3 days ago

Hardware Engineer, Principal

MACOM designs and manufactures semiconductor products for various applications. The Principal Hardware Engineer will design, develop, and document complex interconnect solutions, ensuring compliance with standards and collaborating with cross-functional teams.

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H1B Sponsor Likelynote

Responsibilities

The Hardware Engineer, Principal designs, develops, and documents complex interconnect solutions for internal hardware needs as well as for customer hardware reference designs, identifies techniques and methodologies for modeling and measurement of devices and systems and actively participates in the evaluations of these
The Hardware Engineer, Principal drives feasibility analyses at onset of PCB (printed circuit board) definition phase, evaluates and specifies electrical characteristics and performance of the PCB to determine compliance to appropriate regulating standards, and takes cradle-to-grave ownership of ownership of PCB according to requirements
Collects inputs from users of the PCB, including but not limited to, validation engineer, product engineer, IC design engineer, signal integrity engineer etc
Draft a BRD (Board Required Document) / Block Diagram to clearly define what is expected of the board & review it
Consults with designers, application engineers for component selection and circuit around the device under test
Designs complex circuits as required
Captures schematic using EDA tool such as xDxDesigner
Creates electrical symbols and layout footprints for new components
Creates Bill of Material (BOM)
Maintains CAD library
Creates layout of the board using EDA tools such as Siemens PADS
Interacts with external vendors as necessary
Performs Power Integrity of assigned boards using PI Analysis tools such as HyperLynx Power Integrity
Perform Signal Integrity simulations and analysis of assigned boards using tools such as Ansys SiWave or HFSS
Collaborate with PCB layout engineers to optimize routing for high-speed signals
Develop and validate models for transmission lines, connectors, vias, and IC packages
Conduct pre- and post-layout SI analysis to ensure compliance with design specifications
Support design reviews and provide recommendations for signal integrity improvements
Work closely with cross-functional teams including electrical, mechanical, and firmware engineers
Perform lab measurements using oscilloscopes, VNAs, and TDRs to correlate with simulation results
Document analysis results and present findings to engineering leadership
Creates documentation for PCB fabrication and work with PCB vendors to resolve issues during manufacturing
Prepares Bonding Diagram for high-speed Optical interface and Chip on Board devices
Creates high-speed board design rules for automation and to speed up the Layout design time and effort
Organizes and drives board design reviews for assigned projects
Drives PCB verification and debug (board bring-up) covering both board functionality and performance
Provides mentorship to junior members of the team

Qualification

PCB DesignSI simulation toolsHigh-speed interfacesTransmission line theoryCAD toolsDFM knowledgeLab equipmentProblem-solving skillsCommunication skills

Required

PhD with 4 or more years of experience or MSEE with 6 or more years of experience or BSEE with 8 or more years of experience
6 or more years of experience/knowledge in schematic capture, PCB Design and layout using CAD tools such as xDxDesigner, PADS, HyperLynx, Siwave and HFSS
Strong understanding of transmission line theory, impedance control, crosstalk, and jitter
Proficiency in SI simulation tools and lab equipment
Experience with high-speed interfaces such as PCIe, DDR, USB, Ethernet, etc
Extensive knowledge on Board Design for manufacturing (DFM), PCB Fab Process
Extensive experience with lab equipment including VNAs, BERTs
Excellent problem-solving and communication skills

Preferred

Experience with CAD Library creation/maintenance is a plus
Knowledge on firmware development and microcontrollers is a plus

Benefits

Health, dental, and vision insurance.
Employer-sponsored 401(k) plan.
Paid time off.
Professional development opportunities.

Company

MACOM is a supplier of high-performance analog RF, microwave, millimeterwave, and photonic semiconductor products.

H1B Sponsorship

MACOM has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (7)
2024 (8)
2023 (16)
2022 (2)
2021 (6)
2020 (5)

Funding

Current Stage
Public Company
Total Funding
$43.75M
2012-03-15IPO
2011-01-12Private Equity
2010-06-08Private Equity· $43.75M

Leadership Team

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Stephen Daly
President & CEO, Director
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Cristian Stagarescu
Principal Engineer Photonics R&D
Company data provided by crunchbase