Nokia · 4 weeks ago
Silicon Photonics Packaging Engineer Co-op
United States
Full-time
Remote
New GradNokia is a global leader in connectivity for the AI era, and they are seeking a Silicon Photonics Packaging Co-op for their Summer 2026 Term. The role involves engaging in the research and development of silicon photonics transceiver modules, including developing packaging processes and collaborating with cross-functional teams.
ElectronicsEnterprise SoftwareInternet of ThingsMobile DevicesTelecommunications
Responsibilities
Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers
Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met
Own Design Rules documents and ensure Design for Manufacturing specifications are met
Perform mechanical integrity and thermal simulations, tolerance analyses and characterization
Drive package debug activities during product validation and qualification
Plan and Drive prototype assembly builds to enable deliveries for early design validation
Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements
Qualification
Required
Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA
Experience with package and process design/development from design to production
Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs
Experience with documentation of fabrication, inspection, and assembly processes
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively
Preferred
Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages
Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging
Experience in high-speed electronics package design and/or laser package design
Experience with thermo-mechanical simulations using ANSYS or similar software
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging
Familiarity with design and simulations of optical packaging using free space optics or fiber coupling
Company
Nokia
Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb.
Founded in 1865
10001+ employees
H1B Sponsorship
Nokia has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (262)
2024 (264)
2023 (259)
2022 (250)
2021 (296)
2020 (287)
Funding
Current Stage
Public CompanyTotal Funding
$4.45BKey Investors
European Investment BankNVIDIANational Telecommunications and Information Administration
2025-12-16Post Ipo Debt· $511.84M
2025-10-28Post Ipo Equity· $1B
2025-06-30Post Ipo Debt· $1.76B
Leadership Team
Justin Hotard
President and CEO
Victoria Hanrahan
Chief of Staff to the CEO
Recent News
2026-01-09
2026-01-09
Mobile World Live
2026-01-09
Company data provided by crunchbase