3D Glass Solutions, Inc. · 1 month ago
Technical Program Manager - Electronic Packaging
3D Glass Solutions, Inc. is seeking a highly motivated Technical Program Manager to lead complex, cross-functional programs in the advanced electronics packaging space. This role involves overseeing the full lifecycle of electronic packaging projects and requires strong technical and project management skills to ensure alignment across multiple stakeholders and timely delivery of programmatic milestones.
Electronics
Responsibilities
Program Ownership: Lead end-to-end execution of technical programs from customer kick-off through design, fabrication, assembly, test, and delivery
Customer Engagement: Act as the primary interface for customers on program status, milestones, and technical coordination. Translate customer requirements into actionable internal tasks
Cross-Company Coordination: Collaborate with engineering, manufacturing, supply chain, quality, and external vendors to ensure alignment of schedule and deliverables
Schedule & Deliverable Management: Develop, maintain, and drive integrated program schedules. Monitor progress and escalate issues as needed to maintain momentum
Risk Management: Identify program risks early, develop mitigation plans, and drive resolution of technical and logistical challenges
Technical Leadership: Work closely with engineering teams to ensure that designs are feasible, manufacturable, and aligned with customer expectations
Status Reporting: Deliver regular updates to internal stakeholders and customers on program health, risks, and completion metrics
Process Improvement: Contribute to the continuous improvement of program management processes and tools
Qualification
Required
Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field)
5+ years of experience in technical program management or engineering leadership roles, ideally in electronics packaging, semiconductor, or hardware development
This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship due to government contracts
Deep understanding of the product lifecycle in advanced electronics packaging, including design, fabrication, assembly, and test
Proven experience managing cross-functional teams in a fast-paced, highly technical environment
Strong communication and interpersonal skills; ability to work directly with customers and internal executives
Expertise in project management tools (e.g., MS Project, Smartsheet, Jira) and methodologies
Demonstrated ability to manage schedules, drive accountability, and deliver results under tight deadlines
Must be able to wear personal protective gear most of the day (where applicable)
Prolonged periods of sitting or standing
Preferred
Master's degree
PMP or similar project management certification
Experience working with defense, aerospace, or medical device customers (including navigating compliance and documentation requirements)
Experience working in or with a high-mix, low-volume manufacturing environment
Familiarity with advanced packaging technologies (e.g., 2.5D/3D integration, chiplets, substrate design)
Benefits
Work on cutting-edge technology in the rapidly evolving field of advanced packaging and RF electronics.
Collaborate with industry-leading experts to solve complex thermal challenges for next-generation products.
Be part of a dynamic, innovative startup environment, offering significant opportunities for professional growth and career development.
Opportunity to make a direct impact on high-performance systems used in industries like telecommunications, defense, and computing.
Company
3D Glass Solutions, Inc.
3D Glass Solutions, Inc. (3DGS) is a private late-stage high-tech manufacturing business headquartered in Albuquerque, New Mexico.
Funding
Current Stage
Growth StageTotal Funding
$66.07MKey Investors
Walden CatalystNew Mexico Economic Development DepartmentIntel Capital
2023-04-19Series C· $30M
2022-06-03Grant· $0.07M
2022-01-31Series B· $4M
Recent News
2025-09-25
2025-09-04
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