Foxconn · 1 month ago
Field Application Engineer - PCB
Austin, TX, US
Full-time
Hybrid
Mid, Senior Level, Lead/Staff
8+ years expFoxconn E BG Group is a leading provider of technological solutions and the world’s largest electronics manufacturer. The Field Application Engineer - PCB provides technical support for customer design and engineering teams, facilitating the integration and application of the company’s products in customer environments.
Consumer ElectronicsElectronicsHardwareInformation TechnologyManufacturingProduct DesignSoftware
Responsibilities
Provide application and product-level support to clients
Collaborate with customer engineering teams on integration, debugging, and performance optimization
Translate client technical requirements to internal R&D teams
Deliver technical training, product demos, and documentation to customers
Conduct failure analysis (FA) and root-cause investigation and recommend solutions
Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing)
Optimize testing processes and create reliable automated test programs
Collaborate cross-functionally with R&D, manufacturing, and quality teams to ensure products meet engineering specifications and customer expectations
Create field reports, support documentation, and provide feedback for continuous improvement
Leverage extensive personal experience in PCB design and material science to become a trusted partner for our customers
Stay updated on PCB technology trends and industry developments; propose recommendations to support product improvement and innovation
Perform other duties as assigned
Qualification
Required
Bachelor's degree in Electronic Engineering or related field
3-5 years of experience in PCB design, manufacturing, or testing
Additional work experience should be related to the electronics industry, with a total of approximately 8 years of professional experience
Familiarity with Electronic Components
Familiarity with PCB fundamentals: stack-up / bring-up / FR4 / Rogers / TH / micro-via / HASL / ENIG
Familiarity with High-Speed Signals / PI / EMC
Familiarity with Manufacturing and Assembly: SMT / BGA / reflow profile / AOI / X-ray
Familiarity with PCB-related tools: AutoCAD / Polar / SI9000 / Genesis / InFlow
Proficient in Excel for data analysis
Excellent communication and problem-solving skills, with the ability to collaborate effectively with customers and internal teams
Willingness to travel to customer sites to provide technical support
Ability to travel to Asia. (China, Vietnam)
Preferred
Experience with Minitab and DOE methodologies
English and Mandarin speaking preferred
Company
Foxconn
Established in Taiwan in 1974, Hon Hai Technology Group (Foxconn) (2317: Taiwan) is the world’s largest electronics manufacturer.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$5.75BKey Investors
Sprint Vc
2025-10-28Post Ipo Debt· $757.58M
2025-08-07Post Ipo Debt· $3.82B
2024-11-20Post Ipo Debt· $1.1B
Leadership Team
S
Shen Tao-pang
Chief Financial Officer
IC Lin
Senior AVP
Recent News
2026-01-22
2026-01-22
Company data provided by crunchbase