Radio Frequency (RF) Architect, Texas Institute for Electronics jobs in United States
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The University of Texas at Austin · 4 weeks ago

Radio Frequency (RF) Architect, Texas Institute for Electronics

The University of Texas at Austin is a leading educational institution, and they are seeking a Radio Frequency (RF) Architect for the Texas Institute for Electronics. This role will develop advanced RF and mixed-signal microsystems for high-performance communication, radar, and sensing applications, involving architecture definition, simulation, testing, and collaboration with partners.

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Responsibilities

Architect RF and mixed-signal microsystems operating across K-band (18–27 GHz), Ka-band (27–40 GHz), and W-band (75–110 GHz) for high-performance, low-latency communication, radar, and sensing applications
Define and drive RF front-end architectures, including LNAs, PAs, mixers, phase shifters, and T/R modules, optimized for 3.0D integration and advanced packaging flows
Collaborate with device, packaging, and digital architects to achieve co-optimization of RF, thermal, and mechanical performance within heterogeneous multi-die systems
Lead EM/circuit co-simulation and system-level modeling using tools such as HFSS, ADS, AWR, or CST to validate and tune design performance across process corners and temperature
Oversee RF testing, characterization, and calibration at wafer, die, and module levels—developing test plans, de-embedding strategies, and measurement automation for K/W-band hardware
Engage with foundry, EDA, and metrology partners to define design enablement requirements for next-generation RF packaging (e.g., hybrid bonding, AiP, glass/Si interposers)
Author technical documentation, reference designs, and design guidelines to accelerate ecosystem adoption of TIE’s 3.0D RF microsystems platform
Other related functions as assigned

Qualification

RF/microwave IC designRF simulation toolsS-parameter characterizationEM/circuit co-simulationAntenna-in-Package (AiP)3DHI design flowsWafer-level probingThermal-vacuum characterizationTechnical writingPresentation skillsCross-functional collaboration

Required

M.S. in Electrical Engineering, Applied Physics, or related discipline focused on RF, microwave, or millimeter-wave design
At least 8 years of hands-on experience designing, simulating, and testing RF/microwave ICs or modules (K-band and above)
Deep expertise in S-parameter characterization, on-wafer measurements, vector network analysis, and de-embedding methodologies
Proficiency with RF simulation and design tools such as Keysight ADS, Ansys HFSS, Cadence AWR, CST Studio, or equivalent
Strong understanding of electromagnetic effects in packaging—signal integrity, coupling, and loss across interposers and redistribution layers
Proven track record in RF testing automation, data analysis, and test correlation between EM models and measured results
Ability to work cross-functionally with device, packaging, EDA, and system teams in a fast-moving R&D environment
Location: Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30–50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations
Relevant education and experience may be substituted as appropriate

Preferred

Ph.D. in Electrical Engineering, Applied Physics, or related discipline focused on RF, microwave, or millimeter-wave design
More than 8 years of hands-on experience designing, simulating, and testing RF/microwave ICs or modules (K-band and above)
Experience developing Antenna-in-Package (AiP), RFIC/SiP, or 3D-stacked RF front-end modules for advanced communications or sensing
Familiarity with 3DHI design flows and RF/mixed-signal co-simulation using advanced EDA environments (Cadence, Synopsys, Siemens, Ansys)
Hands-on experience with wafer-level probing, cryogenic testing, or thermal-vacuum characterization for high-frequency systems
Knowledge of GaAs, GaN, SiGe, or CMOS RF processes, and packaging constraints for high-frequency operation
Publication or patent record in millimeter-wave circuits, antennas, or RF packaging
Strong technical writing and presentation skills for industry and defense-sector collaborations

Benefits

Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

Company

The University of Texas at Austin

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The University of Texas at Austin is one of the largest public universities in the United States.

H1B Sponsorship

The University of Texas at Austin has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (282)
2024 (210)
2023 (175)
2022 (186)
2021 (187)
2020 (190)

Funding

Current Stage
Late Stage
Total Funding
unknown
Key Investors
Republic Capital Group
2022-09-14Series Unknown

Leadership Team

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Will Whiting
Chief Development Officer
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Company data provided by crunchbase