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The University of Texas at Austin · 1 month ago

Product Engineer I - II or Sr. Product Engineer, Texas Institute for Electronics

Austin, TX

Full-time

Onsite

Entry, Mid, Senior Level

3+ years exp

The University of Texas at Austin's Texas Institute for Electronics is seeking motivated individuals to join their team focused on advancing semiconductor manufacturing. The role involves IC & Test Structure product validation and optimization of manufacturing and design processes to enhance yield, performance, and reliability across various customer materials and micro-systems.

Corporate TrainingEducationHigher EducationUniversities

No H1B

Responsibilities

Product and test vehicle validation to specifications, development and optimization of manufacturing/test workflows, 2.5D/3D modeling accuracies, creation of BKM’s (Best Known Practices) to comprehend and optimize Power/Thermal/Mechanical/Signal Integrity/RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems

Contribute to the design and development of 2.5D & 3D advanced packaging solutions for semiconductor devices. Develop and support TIE's 3D-ADK (Assembly Design Kit)

Interpret fab metrology, defect, E-test yield, and evaluate silicon-to-simulation correlation accuracies to understand and quantify process variations and their impacts on performance, yield, and reliability

Drive corrective actions across cross-functional teams to fix and identify root-cause systematic yield and reliability issues. Perform Failure analysis on products manufactured at TIE

Collaborate with internal and external design teams to ensure package compatibility with semiconductor die and system-level requirements. Design and execute appropriate DOE’s

Stay current with industry trends and emerging technologies in semiconductor packaging and design integration to drive innovation and continuous improvement

Define product DFT & DFM requirements and methodologies. Help with ATE Test plan definitions and requirements

Bench/lab validation and characterization of various IC solutions and test structures to understand multi-physics impacts of our 3DHI processes

Leverage data analytics to drive product yield and reliability optimization

Own entire product life cycle from bring up, performance/yield/reliability optimization, to customer qualification

Collaborate with customers to understand and resolve field failures

Qualification

Semiconductor device physicsProduct validationProgramming in PythonData analyticsMixed signal IC behaviors3D packaging solutionsFailure analysisAnalytical skillsCommunication skillsTeamwork skillsProblem-solving skillsAttention to detailProject management

Required

Product Engineer I: Bachelor's degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science or relevant field

Product Engineer II: Bachelor's degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science, and a minimum of three years of relevant industry experience

Senior Product Engineer: Bachelor's degree in Electrical Engineering, Semiconductor Physics, or Materials Science, and a minimum of ten years of relevant industry experience

Strong understanding of semiconductor device physics and mixed signal IC behaviors

Proficient programming skills in languages such as Python, MATLAB, C/C++, or Perl… for data analysis, and automation

Strong communication and teamwork skills, with the ability to collaborate effectively with cross-functional teams

Excellent analytical and problem-solving skills, as well as attention to detail

Ability to thrive in a fast-paced environment and manage multiple projects simultaneously

(Eng II or Senior): Prior experience in semiconductor design, product engineering, process Integration/manufacturing, Test, or packaging required

Relevant education and/or industry experience may be substituted as appropriate

Preferred

Master's degree or PhD in semiconductor engineering fields such as Electrical Engineering, Materials Science, Semiconductor Physics or other relevant disciplines

Experience or Interest in (for entry level) at least one of the following areas: IC/Micro-system Design, Product Validation, Test, Process or wafer fab Integration, Semiconductor Packaging manufacturing, Thermal/stress optimization, and/or quality assurance, ATE and/or Bench validation of IC's or process test structures, Semiconductor Failure analysis. (SEM/CSAM experience…), Materials packaging/stress/strain evaluations and process controls, Data analytics using scripting/programming putting results into tables/graphs/reports. (JMP, Power BI, Excel…), BIST definition and/or validation. Design & TEST BKM, and Apps engineering / Micro-system Product definition and requirements

Experience in a startup or research and development (R&D) environment