The University of Texas at Austin · 4 weeks ago
Design Engineering Manager, Texas Institute for Electronics
Austin, TX
Full-time
Onsite
Senior Level, Lead/Staff
10+ years expThe University of Texas at Austin's Texas Institute for Electronics is a leading semiconductor consortium focused on innovative manufacturing technologies. The Design Engineering Manager will oversee a team of engineers in designing advanced semiconductor circuits and packaging solutions, ensuring high reliability and performance.
Corporate TrainingEducationHigher EducationUniversities
Responsibilities
Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment
Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems
Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities
Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages
Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility
Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies
Other related functions as assigned
Qualification
Required
Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field
10+ years of relevant industry experience in semiconductor IC design
Previous supervisory experience with small to medium-sized teams
Strong understanding of semiconductor device physics and mixed signal circuit design
Excellent problem-solving skills and attention to detail
Strong communication and teamwork skills
Ability to manage multiple projects in a fast-paced environment
Proficiency in industry-standard EDA software for circuit and/or package design
Preferred
Master's or higher degree in relevant semiconductor engineering fields
Experience with 2.5D and 3D semiconductor packaging technologies
Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging)
Strong background in DFT/DFM methodologies and BIST techniques
Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF)
Experience in a startup or R&D environment
Benefits
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
Company
The University of Texas at Austin
The University of Texas at Austin is one of the largest public universities in the United States.
10001+ employees
H1B Sponsorship
The University of Texas at Austin has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (282)
2024 (210)
2023 (175)
2022 (186)
2021 (187)
2020 (190)
Funding
Current Stage
Late StageTotal Funding
unknownKey Investors
Republic Capital Group
2022-09-14Series Unknown
Leadership Team
Will Whiting
Chief Development Officer
Recent News
Crunchbase News
2025-12-16
Crunchbase News
2025-11-06
2025-02-18
Company data provided by crunchbase