The University of Texas at Austin · 4 weeks ago
Metrology Development Engineer II or Senior Metrology Development Engineer, Texas Institute for Electronics
The University of Texas at Austin's Texas Institute for Electronics is focused on advancing semiconductor manufacturing technologies. The Metrology Development Engineer will lead efforts in measurement and characterization infrastructure, collaborating with teams to optimize processes and develop cutting-edge metrology tools.
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Responsibilities
Lead the selection, procurement, installation and qualification of metrology equipment and systems
Develop a TIE-specific metrology tool set that effectively measures electrical, thermal, and mechanical performance metrics for 3DHI systems
Support TIE by providing accurate and actionable measurement data to sister groups working on process development
Provides vision and direction in developing forward-looking measurement technologies and establish a robust metrology roadmap
Drive corrective actions as a part of cross-functional teams to identify systemic yield and reliability issues. This includes performing failure analysis to troubleshoot/root-cause
Participate in the hiring process for technicians and junior engineers to support the workforce development of TIE
Other related functions as assigned
Qualification
Required
Bachelor's degree in Mechanical Engineering, materials science, chemical engineering, electrical engineering, or other relevant discipline
Minimum 5 years of experience working in Mechanical R&D roles with prior experience in metrology labs and semiconductor industry
Skilled in all aspects of thermal and mechanical metrologies spanning fundamental theory and design to practical application of novel measurement methods
Mission oriented approach with ability to manage multiple projects simultaneously
Excellent written and verbal communication skills
Demonstrated ability to work successfully in a collaborative team environment
Experience writing and working with project level requirements and specifications
Excellent analytical and problem-solving skills, as well as attention to detail
Preferred
Experience in a startup or research and development (R&D) environment
Prior experience in semiconductor design, characterization, and/ or process integration
Solid understanding of semiconductor packaging technologies, including wire bonding, flip-chip, wafer-level packaging, and 3DHI a plus
Prior experience in software development for hardware control and instrumentation
Experience leading teams, working with contractors and managing people
Benefits
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
Company
The University of Texas at Austin
The University of Texas at Austin is one of the largest public universities in the United States.
H1B Sponsorship
The University of Texas at Austin has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (282)
2024 (210)
2023 (175)
2022 (186)
2021 (187)
2020 (190)
Funding
Current Stage
Late StageTotal Funding
unknownKey Investors
Republic Capital Group
2022-09-14Series Unknown
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