The University of Texas at Austin · 1 month ago
Senior or Principal Product Manager, Texas Institute for Electronics
Austin, TX
Full-time
Hybrid
Senior Level, Lead/Staff
5+ years expThe University of Texas at Austin is a leading educational institution, and they are seeking a Senior or Principal Product Manager for the Texas Institute for Electronics. This role focuses on driving the product strategy and roadmap for advanced microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives.
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Responsibilities
Own the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives. In this role (reporting into TIE’s Business Group), you will serve as the bridge between technical teams and customer requirements to drive product success
Author and maintain comprehensive Product Requirements Documents (PRDs) that guide TIE’s process development, EDA integration, and packaging engineering teams. You’ll ensure all stakeholders have a clear blueprint so development efforts remain aligned, efficient, and focused on the right prioriTIEs
Drive cross-functional collaboration across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure product features and releases are cohesive and aligned with overall strategy. You will be the key interface keeping everyone on the same page and moving toward common goals
Engage closely with customers and industry partners (e.g. leading foundries and advanced packaging providers) to align our capabilities with evolving industry needs. You will represent TIE in technical discussions, gather customer feedback, and form strategic partnerships that enhance our microsystems platform and ecosystem presence
Serve as a technical champion for 2.5D/3D integration – leverage your deep understanding of advanced packaging technologies to guide internal decision-making. You’ll act as a liaison in customer design reviews and industry forums, ensuring TIE’s solutions address real-world challenges in chiplet-based system design
Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive predictable delivery of platform milestones. You will deliver results in fast-paced, multi-stakeholder engagements by managing dependencies and proactively resolving roadblocks
Create technical documentation and collateral (such as integration guidelines, reference designs, and user guides) that support customer design teams and highlight the unique value of TIE’s technologies. You’ll ensure our technical content and training materials enable rapid adoption and success for our ecosystem users
Monitor advanced packaging market trends and competitive developments, providing actionable insights to inform product positioning, feature prioritization, and differentiation. Your awareness of emerging standards and ecosystem shifts will help keep TIE at the forefront of the industry
Champion a culture of accountability and transparency across all product workstreams. You make sure stakeholders are informed, expectations are managed, and commitments are met — fostering trust and a shared sense of mission among teams
Other related functions as assigned
Qualification
Required
Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline
Senior Product Manager: 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends
Principal Product Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends
Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques
Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows
Exceptional communication skills
Startup DNA
Execution mindset
Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners
Relevant education and experience may be substituted as appropriate
Preferred
Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field
Proven program management chops – you can demonstrate end-to-end ownership of complex programs involving multiple customer or partner stakeholders
Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage deliverables, and hold teams accountable to milestones
Prior experience at a leading semiconductor foundry or packaging house is a strong plus
Benefits
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
Company
The University of Texas at Austin
The University of Texas at Austin is one of the largest public universities in the United States.
10001+ employees
H1B Sponsorship
The University of Texas at Austin has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (282)
2024 (210)
2023 (175)
2022 (186)
2021 (187)
2020 (190)
Funding
Current Stage
Late StageTotal Funding
unknownKey Investors
Republic Capital Group
2022-09-14Series Unknown
Leadership Team
Will Whiting
Chief Development Officer
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