The University of Texas at Austin · 1 month ago
Senior or Principal Technical Program Manager
Austin, TX
Full-time
Hybrid
Senior Level, Lead/Staff
8+ years expThe University of Texas at Austin is a prominent educational institution, and they are seeking a Senior or Principal Technical Program Manager for the Texas Institute for Electronics. This role leads complex multi-disciplinary initiatives that drive innovation in microsystems technology, ensuring strategic alignment and timely execution while collaborating with both internal teams and external partners.
Corporate TrainingEducationHigher EducationUniversities
Responsibilities
Lead the planning, execution, and delivery of cross-disciplinary programs supporting TIE’s advanced microsystems roadmap
Develop and manage program scopes, schedules, budgets, and risk mitigation plans to ensure predictable delivery across engineering and manufacturing teams
Coordinate efforts across internal R&D, process development, design automation, and partner organizations to align execution with technology and business objectives
Serve as the central liaison between TIE’s technical teams, university researchers, and external stakeholders—including DoD partners, national labs, and commercial collaborators
Drive metrics-based accountability and communication across all program tracks to ensure transparency and stakeholder confidence
Identify dependencies, anticipate bottlenecks, and proactively resolve issues to maintain momentum in a fast-moving environment
Support the generation of technical documentation, customer deliverables, and integration roadmaps that communicate progress and align with contract requirements
Monitor industry trends in advanced packaging, 3DHI, and chiplet-based architectures, informing program direction and partnership strategy
Other related functions as assigned
Qualification
Required
For Senior Technical Program Manager: Industry Experience: 8+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends
For Principal Technical Program Manager: Industry Experience: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends
For both levels: Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline
Technical Expertise: Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques. You have direct experience developing or managing cutting-edge packaging solutions and understand the nuances of modeling, simulation, and reliability across electrical, thermal, and mechanical domains
Process & EDA Familiarity: Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows. You can effectively interface with process engineers and EDA teams, ensuring packaging solutions integrate smoothly with design and manufacturing workflows
Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business stakeholders. You excel at translating between engineering and market/customer contexts
Startup DNA. You're energized by ambiguity, act with urgency, and take ownership of outcomes. You thrive in a fast-paced, dynamic environment and aren't afraid to wear many hats to get the job done
Execution mindset. You have demonstrated experience driving progress across multiple initiatives in a hands-on role, without the need for layers of management. You plan, execute, and deliver—reliably and proactively
Relevant education and experience may be substituted as appropriate
Preferred
Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field
Program Leadership: Proven program management chops – you can demonstrate end-to-end ownership of complex programs involving multiple customer or partner stakeholders. You know how to define success metrics, manage interdependencies, and keep teams aligned and motivated even as projects grow in complexity
Vendor/Partner Management: Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage deliverables, and hold teams accountable to milestones
Industry Background: Prior experience at a leading semiconductor foundry or packaging house is a strong plus, giving you firsthand insight into advanced packaging processes and the broader industry ecosystem
Benefits
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
Company
The University of Texas at Austin
The University of Texas at Austin is one of the largest public universities in the United States.
10001+ employees
H1B Sponsorship
The University of Texas at Austin has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (282)
2024 (210)
2023 (175)
2022 (186)
2021 (187)
2020 (190)
Funding
Current Stage
Late StageTotal Funding
unknownKey Investors
Republic Capital Group
2022-09-14Series Unknown
Leadership Team
Will Whiting
Chief Development Officer
Recent News
Crunchbase News
2025-12-16
Crunchbase News
2025-11-06
2025-02-18
Company data provided by crunchbase