Marvell Technology · 1 day ago
Principal Advanced Packaging Design Engineer
Burlington, VT
Full-time
Onsite
Lead/Staff
8+ years expMarvell Technology is a leading provider of semiconductor solutions that enhance data infrastructure across various domains. The Principal Advanced Packaging Design Engineer will lead project teams in delivering innovative packaging solutions, interface with suppliers, and ensure compliance with performance and reliability standards.
DSPInternet of ThingsManufacturingSemiconductorWireless
Hiring Manager
Magda Melena
Responsibilities
Lead small project teams of design and simulation engineers to deliver innovative high quality packaging solutions
Interface with package suppliers to select package technology to ensure manufacturability and compliance with performance, reliability, and cost requirements
Qualification
Required
Extensive experience in substrate and/or board design for advanced package technologies with basic understanding of design for manufacturing and reliability as well as electrical performance and the ability to make trade off decisions accordingly
Proven ability to lead complex package architecture development projects involving all relevant internal and external customer stakeholders
Mastery in tools and workflows: Cadence 3DIC/ISP/APD/SiP
Bachelor's degree in electrical engineering or related fields and 15+ years of related professional experience or master's degree and 12+ years of related professional experience or PhD degree with 8+ years of experience
Innovative thinking, fundamental understanding of design rules, breakout, place and route, signal shielding, reference plane, power distribution, pinout considering overall package and system requirements
Experience with current generation HBM, DDR, SerDes, D2D, D2H, ADC, DAC, PCIE, Ethernet, etc
Good understanding of signal and power integrity at substrates, board, package, and system level
Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC
Familiarity in tools and workflows: Cadence Sigrity/Clarity/Innovus/Virtuoso, Ansys, AutoCAD, SolidWorks
Experience contributing to tool, process, and flow development, library maintenance
Experience interacting with chip design and electrical simulation teams to optimize the design. Familiarity with running and interpreting signal and power simulations is a plus
Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe
Strong communication, presentation and documentation skills
Benefits
Employee stock purchase plan with a 2-year look back
Family support programs to help balance work and home life
Robust mental health resources to prioritize emotional well-being
Recognition and service awards to celebrate contributions and milestones
Company
Marvell Technology
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.
5001-10000 employees
H1B Sponsorship
Marvell Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (186)
2023 (154)
2022 (210)
2021 (210)
2020 (165)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired
Leadership Team
Matthew Murphy
Chairman and CEO
Radha Nagarajan
SVP & CTO, Optical Engineering
Recent News
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