Qualcomm · 1 day ago
Principal Customer Engineering (CE) Lead – Server Processor Platforms
Santa Clara, CA
Full-time
Onsite
Senior Level, Lead/Staff
$189K/yr - $284K/yr
6+ years expQualcomm Technologies, Inc. is a leading semiconductor innovator seeking a Principal Customer Engineering Lead for their Customer Engineering team. This role involves serving as a technical interface between strategic customers and internal product teams, driving customer adoption of server processor platforms from concept to commercialization while providing technical support and leadership as the team grows.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Lead hardware support for strategic customers adopting server processor SoCs, including hyperscalers, OEMs, and ODMs
Act as the primary technical interface for customer hardware teams during design, bring-up, validation, and deployment phases
Perform detailed reviews of customer schematics, PCB layouts, thermal designs, power delivery networks, and signal integrity plans
Support SoC interface validation and debug across DDR, PCIe Gen6/Gen7, CXL, Ethernet, and other high-speed interfaces
Collaborate closely with internal engineering, software, validation, and product teams to address technical challenges and customer feedback
Identify gaps in customer and internal design expectations and propose practical solutions or mitigations
Familiarize with the reference platforms and platform implementation guides developed by internal teams to effectively support customer development
Deliver high-quality technical documentation, training, and onboarding material for customer enablement
Drive continuous improvement of support processes and infrastructure to scale across customer engagements
Help shape the future of the server CE team and serve as a technical leader as the team grows
Qualification
Required
Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 8+ years of Hardware Applications Engineering or Hardware Design experience or related work experience
OR Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 7+ years of Hardware Applications Engineering or Hardware Design experience or related work experience
OR PhD in Electrical/Electronics Engineering, Computer Engineering, or related field and 6+ years of Hardware Applications Engineering or Hardware Design experience or related work experience
Preferred
10+ years of experience in server platform design, bring-up, or customer-facing technical roles
Prior experience supporting hyperscalers, OEMs, or ODMs in server hardware deployment
Deep understanding of high-speed board design principles including: DDR5, PCIe Gen6/Gen7, CXL, SerDes, and Ethernet
PDN design, SI/PI simulation and debug, EMI/EMC mitigation
Experience with system bring-up and debug tools: oscilloscopes, logic analyzers, BERTs, etc
Familiarity with system firmware (UEFI, BMC, BIOS) interactions during hardware validation
Exposure to server platform compliance and interoperability standards (e.g., OCP, JEDEC, PCI-SIG)
Programming or scripting experience (e.g., Python, shell) to aid automation or debug
Excellent communication, organizational, and leadership skills
Demonstrated ability to influence internal teams and manage customer engagements with high autonomy
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package designed to support your success at work, at home, and at play
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
Recent News
2026-01-07
2026-01-07
2026-01-07
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