Intel Corporation · 3 days ago
External Technology Integration Engineer
Phoenix, AZ
Full-time
Hybrid
Mid, Senior Level
$161K/yr - $303K/yr
4+ years expIntel Corporation is seeking an exceptional External Technology Integration Engineer to join their Elite Technology Integration Team. This role involves spearheading the integration of advanced memory and foundry silicon technologies into revolutionary packaging architectures, driving critical technology milestones from concept to production.
Semiconductors
Responsibilities
Lead the technical integration of external memory and/or foundry silicon technologies into Intel's advanced packaging platforms
Drive comprehensive chip-to-package interaction (CPI) assessments across Si backend fab, bump, singulation, assembly, and test domains
Qualify breakthrough foundry Si/memory technologies and establish innovative Si far back-end and bump design rules
Orchestrate complex technical programs with multi-disciplinary stakeholders to deliver game-changing results
Define package performance specifications and achieve technology certification through strategic test vehicle design layout and data collections
Pioneer research on materials and properties to solve complex CPI failure mechanisms
Establish critical material and process specifications for foundries and contract assemblers
Lead and influence both internal and external stakeholders towards desired direction and timely execution
Provide succinct presentations to senior executive management team along with excellent verbal and written communication skills
Qualification
Required
Bachelor's degree in Materials, Chemical Engineering, Chemistry, Physics, Mechanical Engineering with 6 years related field experience
Master's degree in Materials, Chemical Engineering, Chemistry, Physics, Mechanical Engineering with 4 years related field experience
PhD degree in Materials, Chemical Engineering, Chemistry, Physics, Mechanical Engineering with 2 years related field experience
2 years developing and qualifying microelectronic packaging processes for high-volume manufacturing (OR)
2 years integrating complex packaging assembly components including design specifications, manufacturing processes, materials selection, and tooling requirements (OR)
2 years managing technical programs with demonstrated experience in: (OR)
+ Technical planning and scheduling
+ Program execution and monitoring
+ Completion of packaging assembly process certifications
2 years managing external relationships including:
+ Supplier process, material, and tool management
+ Customer program management with committed delivery schedules
Preferred
Experience in various versions of 2.5D and 3D advanced package architectures in the industry, their fabrication processes/materials/tools and their interaction and driving yield improvement activities for these advanced package architectures
Extensive experience in conducting failure mode and effects analyses (FMEA), technical risk assessments (TRA) and statistical process control (SPC) analyses
Experience in defining a silicon - package architecture through fit study, technical risk assessments along with design for yield (DFY) and design for reliability(DFR) considerations
Extensive experience in Si far-backend fab processes, memory/packaging technology, memory silicon/package interactions, silicon and/or package debug verifications, structure property relationships and material characterizations
Experience in model-based problem solving (MBPS) methodologies and quality/yield management through 8D templates
Experience working with foundries, OSATs and familiarity with Si design, tape-in/tape-out processes
Experience with using EDA tools and Si design collaterals, signal integrity (SI) parameters and power characterization and high-speed IO signaling
Benefits
Competitive pay
Stock
Bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
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Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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