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Qorvo, Inc. · 1 day ago

Staff Mechanical/Thermal Design Engineer

Richardson, TX

Full-time

Onsite

Lead/Staff

8+ years exp

Qorvo, Inc. supplies innovative semiconductor solutions and is seeking an experienced Staff Mechanical/Thermal Engineer to join their Defense & Aerospace product development team. The role involves leading mechanical design and development efforts of RF power amplifiers for defense communications, radar, and electronic warfare applications.

Network HardwareSemiconductorWireless

No H1B

Hiring Manager

Kimberly Radi, CIR

Responsibilities

Staff level Mechanical/Thermal Engineer developing next generation microelectronic packaging technology with emphasis on thermal analysis

Chosen candidate will work closely with select team of IC designers, circuit designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward

Using FEA and other industry standard simulations tools: Perform detailed modeling and optimization of thermal design at the die/package/board level Perform mechanical stress modeling and optimization at the die/package/board level Develop and execute thermal measurement techniques to support analysis for internal and external customers

Guide package and substrate design decisions that meet performance specifications and yield requirements

Supervise and respond to manufacturing issues as they occur

Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends

Support external customers with applications thermal models and failure analysis support

Qualification

Mechanical EngineeringSemiconductor PackagingANSYSSolidworksMicroelectronic AssemblyThermal AnalysisFailure AnalysisGD&TCross-functional CollaborationVerbal CommunicationWritten Communication

Required

BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 8 years' experience in semiconductor packaging

Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries

Expert level skill with ANSYS and Solidworks, or similar

Knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies

Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow

Knowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipment

Knowledge of reliability calculation methods for semiconductors

Understanding of GD&T, ANSI standards and tolerance stack-ups required

Demonstrated ability to work with cross-functional teams

Excellent verbal communication and interpersonal skills

Excellent written communications skills