Ultimate Staffing ยท 4 weeks ago
SMT PROCESS ENGINEER
Ultimate Staffing is seeking a Surface Mount Process Engineer responsible for developing, optimizing, and supporting Surface Mount Technology (SMT) processes in a contract manufacturing environment. The role involves providing technical leadership, troubleshooting production issues, and driving process improvements using Lean Manufacturing and Six Sigma principles.
Responsibilities
Provide technical leadership for SMT assembly processes, including stencil printing, solder paste inspection (SPI), pick and place, reflow soldering, X-ray, and automated optical inspection (AOI)
Program and optimize SMT equipment (e.g., screen printers, pick and place machines, reflow ovens, SPI, AOI, and X-ray machines)
Troubleshoot production issues and implement root cause corrective actions to eliminate process defects and downtime
Develop and maintain process documentation, including Manufacturing Work Instructions (MWIs), process control plans, and equipment setup procedures
Drive process improvement initiatives using Lean Manufacturing and Six Sigma principles to increase yields, reduce cycle times, and improve overall process efficiency
Perform Design for Manufacturability (DFM) reviews in collaboration with customers and design engineers to ensure product designs align with best manufacturing practices
Lead SMT line qualification activities, including equipment validation, process capability studies (CPK), and first article inspections (FAI)
Monitor and analyze key performance indicators (KPIs) such as defect rates, line efficiency, and first pass yield (FPY)
Provide training and technical support to operators and technicians to ensure proper process execution
Support Engineering Change Orders (ECOs) and new product introduction (NPI) activities to ensure smooth production ramp-up
Evaluate and qualify new materials, tools, and process technologies for SMT operations
Work with cross-functional teams to ensure adherence to IPC-A-610 and J-STD-001 standards for soldering and assembly
This position does not include direct supervisory responsibilities but may mentor or train junior engineers, technicians, and operators
Other duties may be assigned as required
Qualification
Required
Proficient in programming and operating SMT equipment including: Screen printers (e.g., DEK, MPM), Pick and place machines (e.g., Fuji, Yamaha, Panasonic, Juki), Reflow ovens (e.g., Heller, Vitronics) including thermal profiling, SPI and AOI systems (e.g., Koh Young, CyberOptics, Mirtec), X-ray inspection systems for BGA, QFN, and hidden joint analysis
Strong knowledge of SMT stencil design, solder paste behavior, and solder joint inspection criteria
Skilled in Design for Manufacturability (DFM) and Design for Assembly (DFA) analysis
Experienced in process documentation, work instruction development, and production routing using MES tools (e.g., Aegis FactoryLogix)
Capable of performing process capability studies (Cp, Cpk) and statistical process control (SPC) analysis
Proficient in root cause analysis and corrective action methodologies (8D, 5 Whys, Fishbone Diagram)
Familiar with Lean Manufacturing, Six Sigma, Kaizen, and continuous improvement principles
Working knowledge of IPC-A-610 and J-STD-001 standards for electronic assembly
Comfortable using Microsoft Office Suite, especially Excel (pivot tables, data analysis, charts)
Familiarity with ERP systems (e.g., SAP, Oracle, or similar) for BOM, ECO, and production control
Understanding of ESD safety standards and proper handling procedures
Preferred
IPC-A-610 and J-STD-001 certifications preferred
Six Sigma Green Belt or Lean Manufacturing certification is a plus
Experience with CAD/CAM software for PCB layout review (e.g., Altium, Mentor Valor) is a plus