Senior PDK Development Engineer jobs in United States
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Rapidus Corporation · 2 days ago

Senior PDK Development Engineer

Rapidus Corporation is focused on delivering high-quality Process Design Kits (PDKs) for innovative IC product design. As a Senior PDK Development Engineer, you will ensure the completeness, accuracy, and usability of PDKs while supporting both internal and external customers.

ElectronicsManufacturingProduct DesignProduct ResearchSemiconductor
Hiring Manager
Robin Philippe
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Responsibilities

Develop, maintain, and improve PDK components such as DRC, LVS, and RC extraction rule decks
Build and enhance PDK QA flows and validation methodologies
Create and maintain PDK documentation for internal and external users
Provide PDK-related support to both internal design teams and external customers
Collaborate with EDA vendors, IP providers, and the process development team to align PDK deliverables with technology updates and customer needs

Qualification

PDK developmentDRC runset developmentLVS runset developmentParasitic extractionDesign-to-tapeout workflowCollaboration skillsDocumentation skills

Required

Master's degree in Electrical Engineering or related STEM field
10+ years of experience in semiconductor design enablement or PDK development
Deep understanding of the full design-to-tapeout workflow, including schematic, simulation, layout, physical verification, RC extraction, and mask generation
7+ years of experience with DRC runset development (e.g., Siemens Calibre, Cadence Pegasus, Synopsys ICV)
LVS runset development for advanced technology nodes
Parasitic extraction (PEX) rule deck development (e.g., StarRC, Quantus, xACT)

Company

Rapidus Corporation

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半導体を通して人々を幸せに、豊かにし、人生を充実したものにすることを目指し、イノベーションの創出、人材育成、真にグリーン化に取り組む最先端ロジック半導体製造メーカーRapidusの公式アカウントです。 事業内容: 1.半導体素子、集積回路等の電子部品の研究、開発、設計、製造及び販売 2.環境に配慮した省エネルギーの半導体及び半導体製造技術の研究、開発 3.半導体産業を担う人材の育成・開発

Funding

Current Stage
Late Stage
Total Funding
$2.31B
Key Investors
Honda MotorMinistry of Economy, Trade, and Industry
2025-06-10Corporate Round· $6.92M
2023-04-10Grant· $2.25B
2022-11-11Grant· $52.59M

Leadership Team

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Rozalia Beica
Field CTO Packaging Technologies
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Henri Richard
President & General Manager
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Company data provided by crunchbase