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Boston Materials · 3 weeks ago

Senior Mechanical Engineer, Advanced Packaging

Billerica, MA

Full-time

Onsite

Mid, Senior Level

$120K/yr - $170K/yr

3+ years exp

Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. They are seeking a highly motivated Senior Mechanical Engineer to serve as the primary technical partner for customers evaluating and adopting high-performance thermal interface material products. The role involves leading customer interactions, capturing requirements, and ensuring successful integration of products in advanced semiconductor packaging applications.

Advanced MaterialsIndustrial EngineeringManufacturingMechanical EngineeringSemiconductor

No H1B

Responsibilities

Act as the primary technical point of contact for ODM, OSAT, and hyperscaler engineering teams during early and mid-stage engagement

Work closely with business development to uncover and document customer requirements, including thermal budgets, reliability standards, and process/package constraints

Lead internal scoping and coordination of customer-specific technical work, including reliability testing, and evaluation of alternative product variants, compliance ranges, or gaskets

Prepare and deliver technical collateral such as application notes, design guides, and data reports to support customer decision-making and qualification processes

Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams

Capture customer feedback and synthesize insights to guide internal product development and roadmap planning

Partner with sales and business development teams to provide pre-sales technical support and contribute to the overall customer success strategy

Gather and synthesize customer feedback (e.g., on performance, handling, supply chain needs) and bring it back to the product team

Qualification

Semiconductor packagingThermal interface materialsApplications engineeringMaterials ScienceMechanical EngineeringChemical EngineeringReliability testingData analysisReport generationCommunication skillsCross-functional leadership

Required

Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Chemical Engineering, or related field

3–7 years of experience in semiconductor packaging, thermal interface materials, or applications engineering in a B2B technical product company

Strong understanding of semiconductor packaging processes (flip-chip, 2.5D/3D integration, TIM1/TIM1.5/TIM2) and associated reliability testing (uHAST, TCT, HTS, etc.)

Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time

Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders

Hands-on experience with lab testing, data analysis, and report generation; familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus