Micron Technology · 2 days ago
Global Quality IC Package Design/Development Quality Assurance Principal Engineer
Boise, ID
Full-time
Onsite
Senior Level, Lead/Staff
7+ years expMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. As a GQ Package Design/Development Quality Assurance Principal Engineer, you will be responsible for ensuring the quality and reliability of new IC package technology introductions, focusing on advanced memory solutions and mitigating risks prior to New Product Introduction.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Execute technical risk assessment and NUDD (New, Unique, Different, Difficult) analysis for new designs/design rules and lead risk mitigation execution
Develop holistic qualification plans and coordinate execution
Provide recommendations on releasing new package technologies based on test results and technical risk assessments
Serve as SME for problem-solving related to package technology, ensuring effective root cause analysis and corrective/preventive actions
Collaborate with customer-facing teams to draft and present content addressing customer issues and requests
Represent Micron’s interests in industry standards bodies such as JEDEC and AEC
Provide SME support and mentoring to elevate package reliability engineering knowledge across the company
Qualification
Required
Master's degree or equivalent experience in Electrical/Electronics, Mechanical, Material Science and Engineering, Physics, or related field
7+ years of experience in semiconductor package design, manufacturing, or Quality & Reliability (Q&R)
Experience with advanced packaging technologies (e.g., 3DI, Wafer-2-Wafer, SiP)
Expert-level applied knowledge of package-level and board-level reliability test methods, reliability acceleration modeling, and sampling statistics
Expert-level understanding of Chip-Package Interaction and effects of thermomechanical and hygroscopic swelling stresses on reliability
Thorough knowledge of semiconductor package designs, assembly processes, and board-level reliability challenges
Understanding of mechanical and material interaction effects on IC component and PCB assembly reliability
Knowledge of statistics and quality management tools (SPC, FMEA, 8D CAR)
Self-motivated, detail-oriented, and able to work independently with strong analytical and multi-tasking skills
Excellent written and verbal communication skills in English
Preferred
Ability to mentor and publish technical papers (internal and external)
Experience collaborating with industry standards bodies and driving beneficial changes
Strong problem-solving skills and ability to interact effectively with cross-functional teams
Benefits
Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
2026-01-09
The Motley Fool
2026-01-09
2026-01-09
Company data provided by crunchbase