2026 Summer Software/Firmware Engineering Undergraduate Intern jobs in United States
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MKS Inc. · 3 months ago

2026 Summer Software/Firmware Engineering Undergraduate Intern

MKS Inc. is seeking a Software/Firmware Engineering Intern for Summer 2026. This role involves hands-on coding, debugging, and testing software in a technical environment, while also contributing to the development of micromachining laser products.

Enterprise SoftwareInformation TechnologyManufacturing
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H1B Sponsor Likelynote

Responsibilities

Help us characterize & release new micromachining laser products to production
Work with hands-on coding, debugging and testing software and Realtime Embedded systems
Use Arm microcontrollers, ADC/DAC's, serial busses such as I2C, SPI, CAN and help build CI pipelines

Qualification

Embedded systemsArm microcontrollersCI pipelinesElectronics experienceCommunication skillsDetail orientedIndependent work

Required

Enrolled in Bachelor's Degree program in Software/Electrical/Mechatronics Engineering, Physics, or relevant majors
Ideal if hands on experience, working in lab, with equipment and control systems
Experience with electronics desirable
Excellent written and oral communication skills
Normally receives general instructions on new assignments, with some instruction on day-to-day work
Detail oriented and able to work independently

Benefits

11 paid holidays
Sick time
15 paid vacation days accrued on a biweekly basis

Company

MKS Inc.

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MKS enables technologies that transform our world.

H1B Sponsorship

MKS Inc. has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2024 (6)
2023 (5)
2022 (8)
2021 (6)
2020 (4)

Funding

Current Stage
Public Company
Total Funding
$4.97B
2024-05-13Post Ipo Debt· $1.37B
2023-10-03Post Ipo Debt· $3.6B
1999-03-30IPO

Leadership Team

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John T.C. Lee
President & Chief Executive Officer
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H
Hossein Zarrin
Director of Product Marketing
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Company data provided by crunchbase