Software Intern jobs in United States
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Cadence · 1 day ago

Software Intern

positionSan Jose, CA
timeInternship
remoteOnsite
seniorityIntern
money$28.60/hr - $53.12/hr

Cadence is a company that hires and develops leaders and innovators in technology. As an R&D intern, you will focus on developing the next generation routing engine and work in a team environment to improve core routing technology.

AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Developing the next generation routing engine
Work in a team environment to design, improve, and maintain core routing technology as part of Innovus Digital Implementation system

Qualification

Routing algorithm knowledgeC/C++ knowledgeUnix/LinuxMS/PhD in Computer EngineeringTeam collaboration

Required

In progress with MS/Phd in Computer Engineering or Computer Science
C/C++ knowledge
Unix/Linux

Preferred

Routing algorithm knowledge

Benefits

Paid holidays
401(k) plan with employer match

Company

Cadence

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Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.
dateFounded in 1988
location
San Jose, California, USA
people-size10001+ employees
web-link
https://www.cadence.com

H1B Sponsorship

Cadence has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)

Funding

Current Stage
Public Company
Total Funding
unknown
1998-02-20IPO

Leadership Team

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Paul Cunningham
Senior Vice President and General Manager
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Tom Beckley
Senior Vice President, Custom IC & PCB Group
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Recent News

eeNews Europe
Cadence and partners line up for pre-validated chiplets
2026-01-17
GlobeNewswire
Die-to-Die IP Market Size to Surpass USD 3.72 Billion by 2033 | Research by SNS Insider
2026-01-16
Business Wire
Cadence Delivers Enterprise-Level Reliability with Next-Gen Low-Power DRAM for AI Applications Featuring Microsoft RAIDDR ECC Technology
2026-01-15
Company data provided by crunchbase