Sr. Staff/Principal Advanced Packaging Architect jobs in United States
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MediaTek · 1 day ago

Sr. Staff/Principal Advanced Packaging Architect

positionSan Jose, CA
timeFull-time
remoteOnsite
senioritySenior Level, Lead/Staff
money$190K/yr - $270K/yr
date10+ years exp

MediaTek is at the forefront of innovation in data center technologies, seeking a Senior Staff/Principal Advanced Packaging Architect to lead the development of advanced packaging architectures for AI accelerators and data center products. The role involves defining packaging architecture and methodology, collaborating with internal and external partners, and maintaining a deep understanding of industry trends in semiconductor packaging.

Internet of ThingsSemiconductorWireless
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H1B Sponsor Likelynote

Responsibilities

Lead research and development of package architecture for AI accelerators and data center products
Responsible for defining reference packaging architecture and methodology for high‑power, high‑bandwidth multi-chiplet systems, with emphasis on concept development, STCO modeling, and technology selection
Collaborative leader with a strong technical background in semiconductor packaging, metrology, and characterization, who will develop and maintain strong, strategic partnerships with internal engineering teams across packaging, reliability, test, technology integration, and product development, and build collaborative relationships with external partners to ensure alignment of technology and product roadmaps
Provide technical leadership and maintain a deep understanding of industry trends and advancements in semiconductor packaging and characterization
Lead architecture definition of advanced packaging solutions such as 2.5D/3D, CPO, IVR, and HSIO. Partner across silicon, SI/PI, thermal/mechanical, reliability, platform, and vendor teams

Qualification

Semiconductor packagingMetrologyCharacterizationData collectionAnalysisSimulation toolsPythonCommunication skills

Required

M.S. or Ph.D. in Electrical Engineering or a related field
10+ years of experience in packaging, metrology, characterization, and component validation
Experience with wafer level processes, package assembly processes, and substrate technology
Experience with data collection and analysis, including statistical methods
Proficiency in using simulation tools and first principles modeling
Proficiency in scripting languages such as Python for design automation
Excellent communication skills

Benefits

Comprehensive health insurance coverage
Life and disability insurance
Savings plan
Company paid holidays
Sick Leave
Vacation time
Parental leave
401K
And more

Company

MediaTek

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Glassdoor3.8
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MediaTek Inc. is a Taiwanese fabless semiconductor company that provides system-on-chip solutions for wireless communications.
dateFounded in 1997
location
Hsinchu, T'ai-wan, TWN
people-size10001+ employees
web-link
http://www.mediatek.com

H1B Sponsorship

MediaTek has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (71)
2024 (50)
2023 (62)
2022 (48)
2021 (18)
2020 (28)

Funding

Current Stage
Public Company
Total Funding
unknown
2001-07-23IPO

Leadership Team

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Jack Hu
Developer Relations Manager - MediaTek Labs
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