TE Connectivity · 1 month ago
PRINCIPAL R&D/PRODUCT DVL ENGINEER
United States
Full-time
Remote
Senior Level, Lead/Staff
5+ years expTE Connectivity is a global industrial technology leader focused on creating a safer, sustainable, productive, and connected future. As a Principal R&D Product Development Engineer, you will lead the product development of high-speed socket technologies, collaborating with customers and internal teams to drive innovation and ensure product quality.
AutomotiveElectrical DistributionHardwareManufacturingSoftware
Responsibilities
Develop innovative design concepts and conduct feasibility studies to assess technical and commercial viability
Collaborate with global Product Design Engineering (PDE) teams to accurately convert VOC and PRD into detailed design inputs for precise socket development
Create simplified 3D models and perform signal integrity (SI) simulations using advanced tools such as Ansys HFSS to validate electrical signal performance
Build and test prototype samples, execute design validation plans, and complete product qualification to finalize specifications
Lead end-to-end product development of high-speed, fine-pitch, large-size sockets—from market definition, concept creation to design, review, and production release
Foster strong alignment between business and customer engineering teams to deepen market understanding and drive customer-centric innovation
Responsible for mentoring and training engineering teams in advanced mechanical design principles and signal integrity simulation methodologies, including hands-on guidance in using industry-standard tools such as Creo and Ansys HFSS, to ensure design robustness, performance optimization, and alignment with high-speed interconnect requirements
Collaborate closely with customers and internal stakeholders (Sales, System Architects, FAEs, and PMs) to capture clear Voice of Customer (VOC) and translate it into conceptual designs and preliminary product specifications
Engage in early-stage pathfinding with customers to co-develop cutting-edge interconnect solutions that meet future technological needs
Prepare and present engineering evaluations and proposals to customers, aligning solutions with application requirements and performance targets
Provide technical support to manufacturing and quality teams to ensure efficient ramp-up, process optimization, and safe product launches
Support cross-functional teams—including customers, Sales, PMs, and manufacturing sites—through DFMEA, testing, troubleshooting, and engineering analysis
Qualification
Required
Bachelor's degree in Mechanical or Mechatronics Engineering
Minimum of 5 years of work experience in mechanical design for high-speed interconnect products
Direct customer design and support experience, including the ability to work with Field Application Engineers to troubleshoot customer problems and improve existing designs
Expert-level knowledge of interconnect design or experience with high-speed connectors with PCIE Gen 6/7 compliance
High level of competency in mechanical design tools such as Creo/SolidWorks
Good level of competency in signal integrity analysis tools (Ansys HFSS, Keysight ADS)
Strong analytical capabilities to interpret simulation and lab data, identify issues, and provide solutions
Excellent verbal and written communication skills
Ability to work in a global environment, fluent in English (verbal/written), and able to collaborate across geographies
Highly motivated, quick learner, and able to work independently
Preferred
Master's degree
High-speed signal integrity knowledge
Design experience with high-speed servers, switches, and memory
Understanding semiconductor IC packaging and fundamental test/burn-in methodology
Six Sigma methodologies or other strong data analytics background
Company
TE Connectivity
TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.
10001+ employees
H1B Sponsorship
TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)
Funding
Current Stage
Public CompanyTotal Funding
$3.1B2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M
Leadership Team
T
Terrence R. Curtin
Chief Executive Officer
Heath A. Mitts
Chief Financial Officer
Recent News
2025-11-14
Company data provided by crunchbase