Sr Staff Advanced Package Design Engineer - 13846 jobs in United States
cer-icon
Apply on Employer Site
company-logo

Synopsys Inc · 18 hours ago

Sr Staff Advanced Package Design Engineer - 13846

Synopsys Inc is a leader in chip design and verification, driving innovations that shape the future of technology. They are seeking a Sr Staff Advanced Package Design Engineer who will collaborate with cross-functional teams to design and develop advanced silicon package solutions while mentoring peers and driving innovation in packaging methodologies.

Electronic Design Automation (EDA)Information ServicesInformation TechnologySoftware
check
H1B Sponsor Likelynote

Responsibilities

Collaborating with cross-functional teams during early design stages to optimize and define SIPI (Signal Integrity/Power Integrity) performance requirements, including bump mapping and power estimation
Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages
Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance
Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging
Resolving a wide range of design and integration issues using creative, data-driven approaches
Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs
Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies

Qualification

Advanced package designMulti-physics analysisEDA tools proficiencyCircuit theory knowledgeWindowsLinuxAnalytical skillsCreative problem solvingCommunicationCollaborative team playerDetail-oriented

Required

Bachelor's degree in Electrical or Electronic Engineering
Minimum of 10 years' relevant experience in advanced package design, model extraction, and analysis
Expert knowledge of advanced circuit and transmission line theory
Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies
Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.)
Familiarity with both Windows and Linux operating systems
Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler

Preferred

Master's or PhD in Electrical or Electronic Engineering

Benefits

Health
Wellness
Financial benefits

Company

Synopsys Inc

company-logo
Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products.

H1B Sponsorship

Synopsys Inc has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (177)
2024 (216)
2023 (158)
2022 (204)
2021 (215)
2020 (190)

Funding

Current Stage
Public Company
Total Funding
$2B
Key Investors
NVIDIAGreen Pine Capital Partners
2025-12-01Post Ipo Equity· $2B
2022-09-21Post Ipo Equity
1994-01-01Post Ipo Equity

Leadership Team

leader-logo
Aart Geus
Co-Founder, Chairman & CEO
linkedin
leader-logo
Chi-Foon Chan
President and co-Chief Executive Officer
Company data provided by crunchbase